Reinforcement Frames for Thin Interposer Mechanical Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuits face challenges in mechanical stress, heat dissipation, and encapsulant mismatch issues during fabrication and operation, particularly with thin interposers that are brittle and difficult to handle.
Innovation Solution
A reinforcement frame with cavities is used to protect and dissipate heat from dies, potentially eliminating the need for encapsulant and allowing for flexible fabrication sequences, by attaching a separate substrate with cavities to the wiring substrate, which can be thin and rigid, facilitating handling and signal path reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a thin interposer is used to shorten signal paths, then signal transmission speed is improved, but mechanical strength and heat dissipation capability deteriorate
Solution Approach 1:
The interposer structure is segmented into a thin active region for signal transmission and a separate reinforcement frame region for mechanical support. The reinforcement frame is attached to the wiring substrate and surrounds the dies, providing structural strength without interfering with the thin interposer's signal paths. This segmentation allows the interposer to be thin where needed for speed while having reinforced edges for mechanical integrity.
2Device complexity
If a thin interposer is used to reduce assembly complexity, then device complexity is reduced, but ease of operation during fabrication deteriorates
Solution Approach 1:
The reinforcement frame is attached to the wiring substrate before the thin interposer is placed and before dicing operations. This preliminary reinforcement provides mechanical stability during subsequent fabrication steps, making handling easier without requiring complex support structures throughout the entire fabrication process.
3Object-affected harmful factors
If encapsulant is used to protect dies, then protection from contaminants is improved, but warpage occurs due to CTE mismatch
Solution Approach 1:
The reinforcement frame structure provides mechanical support and protection alternatives that reduce or eliminate the need for encapsulant. By taking out the encapsulant or reducing its volume, the source of CTE mismatch warpage is removed while the reinforcement frame maintains die protection through mechanical support and structural integrity.
4Strength
If reinforcement frame is added to provide mechanical support, then strength is improved, but device complexity increases
Solution Approach 1:
The reinforcement frame serves multiple functions simultaneously: it provides mechanical strength to the thin interposer, acts as a structural support during fabrication and operation, and can serve as a thermal management pathway. This multi-functionality reduces the need for separate components, thereby limiting the increase in overall device complexity while achieving the desired mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcement frame enhances mechanical integrity, improves heat dissipation, and simplifies handling of thin interposers, reducing the need for encapsulants and enabling more flexible manufacturing processes while maintaining effective die protection.
Implementation Method 1
the reinforcement frame improves heat dissipation from the dies
Data Source
AI summary
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.