Reinforcement Layer Hydrogen Density for Display Substrate Integrity
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Solution Overview
Problem
During the manufacturing of display devices, substrates often suffer damage or deformation when separated from carrier substrates due to heat and pressure, leading to defects and reduced manufacturing efficiency.
Innovation Solution
Incorporating a reinforcement layer with a hydrogenated amorphous silicon oxide or nitride, which has a lower hydrogen atom density and specific bond ratios, to minimize stress and prevent damage, along with a barrier layer, to ensure the substrate remains intact during separation and subsequent processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a substrate is separated from a carrier substrate during manufacturing, then the display device can be assembled, but the substrate may be damaged or deformed due to heat and pressure
Solution Approach 1:
A reinforcement layer is formed on the substrate before the substrate is separated from the carrier substrate. This preliminary structural enhancement provides mechanical support during the separation process, preventing damage and deformation when the substrate is later subjected to heat and pressure during assembly operations.
Solution Approach 2:
The reinforcement layer is constructed from multiple materials with different hydrogen atom densities - specifically, a first reinforcement layer with lower hydrogen atom density and a second reinforcement layer with higher hydrogen atom density. This composite structure optimizes both mechanical strength for damage prevention and stress management for deformation control during substrate separation and subsequent processing.
2Ease of manufacture
If heat and pressure are applied to the substrate during manufacturing, then components can be connected, but the substrate may bend or deform
Solution Approach 1:
The reinforcement layer is prepared in advance on the substrate before heat and pressure applications occur during component connection. This pre-established structural support system maintains substrate flatness during subsequent thermal and mechanical processing, preventing bending and deformation while allowing necessary assembly operations.
Solution Approach 2:
The reinforcement layer utilizes controlled variations in hydrogen atom density - the first reinforcement layer has lower hydrogen atom density while the second has higher hydrogen atom density. This parameter variation optimizes the mechanical properties of the reinforcement layer, providing appropriate rigidity and stress distribution to prevent substrate deformation under heat and pressure during manufacturing processes.
3Reliability
If the substrate is made more robust to prevent damage, then substrate integrity improves, but manufacturing complexity increases
Solution Approach 1:
The reinforcement layer employs a composite structure with two distinct layers having different hydrogen atom densities. The first reinforcement layer (lower hydrogen density) and second reinforcement layer (higher hydrogen density) work together to provide comprehensive protection - the lower hydrogen density layer offers structural strength while the higher hydrogen density layer provides stress management. This composite approach achieves superior substrate durability without requiring excessive thickness or additional complex components.
Solution Approach 2:
Different regions of the reinforcement structure have different hydrogen atom densities tailored to specific functional requirements. The first reinforcement layer with lower hydrogen atom density provides primary structural support, while the second reinforcement layer with higher hydrogen atom density addresses stress distribution and deformation prevention. This localized optimization of material properties achieves robust substrate protection with controlled complexity rather than uniform over-engineering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate damage and deformation, minimizes internal stress, and enhances manufacturing efficiency by allowing for precise alignment and connection of components, resulting in improved display panel quality and reduced defect rates.
Implementation Method 1
the reinforcement layer may have a stress resistance of about 650 MPa or less
Implementation Method 2
a ratio of a bond between nitrogen and hydrogen of the hydrogenated amorphous silicon nitride to a bond between silicon and hydrogen per unit volume is about 22 or less
Data Source
AI summary
A display device includes: a substrate; a reinforcement layer on the substrate; and a display layer comprising a barrier layer on the reinforcement layer, wherein a number of hydrogen atoms of the reinforcement layer per unit volume is less than a number of hydrogen atoms of the barrier layer per unit volume.