Reinforcement Layer Hydrogen Density for Display Substrate Integrity
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Solution Overview
Problem
During the manufacturing of display devices, substrates often suffer damage or deformation when separated from carrier substrates due to heat and pressure, leading to defects and reduced stress resistance.
Innovation Solution
Incorporating a reinforcement layer with a lower hydrogen atom density, such as silicon oxide or silicon nitride, between the substrate and the barrier layer, which provides stress resistance and minimizes damage during separation, and includes a method of forming multiple reinforcement layers to enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a substrate is separated from a carrier substrate during manufacturing, then the display device can be assembled, but the substrate may be damaged or deformed due to heat and pressure
Solution Approach 1:
A reinforcement layer is formed on the substrate before the substrate is separated from the carrier substrate. This preliminary reinforcement prevents damage and deformation during the separation process, allowing the substrate to withstand the heat and pressure applied during manufacturing while maintaining its structural integrity.
Solution Approach 2:
The reinforcement layer is made from composite materials such as silicon oxide, silicon nitride, or tungsten, which provide enhanced mechanical strength and thermal stability. These composite materials form a protective structure that prevents substrate damage during separation while allowing the display device to be assembled.
2Ease of manufacture
If heat and pressure are applied to the substrate during manufacturing, then layers can be bonded together, but the substrate may bend or deform
Solution Approach 1:
The reinforcement layer is formed on the substrate before heat and pressure are applied during layer bonding. This preliminary reinforcement provides structural support that prevents the substrate from bending or deforming under thermal and mechanical stress, while still allowing the bonding process to proceed.
Solution Approach 2:
The reinforcement layer changes the mechanical and thermal parameters of the substrate system, increasing its resistance to deformation. By modifying the structural properties through the addition of reinforcement materials, the substrate can withstand the heat and pressure of manufacturing without losing its flat shape.
3Reliability
If the substrate is made more robust to prevent damage, then substrate integrity is improved, but the device complexity increases
Solution Approach 1:
The reinforcement layer uses composite materials that provide high damage resistance with minimal thickness. These advanced composite materials achieve superior mechanical strength and thermal stability without requiring thick or complex structures, thus improving substrate integrity while adding minimal complexity to the device.
Solution Approach 2:
The reinforcement layer is applied locally where needed on the substrate, providing targeted protection against damage and deformation. This localized reinforcement approach enhances substrate integrity only in critical areas, avoiding unnecessary complexity in regions where reinforcement is not required.
Data Source
AI summary
A display device includes: a substrate; a reinforcement layer on the substrate; and a display layer comprising a barrier layer on the reinforcement layer, wherein a number of hydrogen atoms of the reinforcement layer per unit volume is less than a number of hydrogen atoms of the barrier layer per unit volume.