Reinforcement Layer for Thermal Deformation Control in Electronic Devices
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Solution Overview
Problem
Devices with components embedded in casting bodies on printed circuit boards experience deformations due to differing expansion coefficients, leading to asymmetrical deformations and material restrictions in choice.
Innovation Solution
A device comprising a carrier plate, a shaped body, and a reinforcement layer, where the shaped body has a higher coefficient of thermal expansion than the carrier and reinforcement layers, which absorb thermal stresses to prevent lateral deformation, with the reinforcement layer positioned vertically between the carrier plate and the shaped body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If materials of the casting body and the printed circuit board are adapted to each other to reduce deformation, then deformation is reduced, but the choice of materials is strongly restricted
Solution Approach 1:
The device is segmented into three distinct layers: a carrier plate (first layer), a shaped body (second layer), and a reinforcement layer (third layer). This segmentation allows each layer to be made of different materials with optimized properties, specifically enabling the shaped body to have a higher coefficient of thermal expansion while the carrier plate and reinforcement layer have lower coefficients, thus reducing overall deformation without restricting material choices
Solution Approach 2:
The invention uses a composite structure combining materials with different coefficients of thermal expansion. The shaped body is made of a material with a higher coefficient of thermal expansion, while the carrier plate and reinforcement layer are made of materials with lower coefficients. This composite approach allows the system to accommodate thermal expansion differences while maintaining overall structural stability and enabling broader material selection
2Stability of the object's composition
If the shaped body has a higher coefficient of thermal expansion than the carrier plate and reinforcement layer, then thermal stresses are absorbed to prevent deformation, but asymmetrical deformation occurs without the reinforcement layer
Solution Approach 1:
The reinforcement layer acts as a counterweight to the thermal expansion forces. By placing a layer with a lower coefficient of thermal expansion on top of the shaped body (which has a higher coefficient), the reinforcement layer counterbalances the expansion forces, preventing asymmetrical deformation and maintaining the symmetry of the light-emitting surface
Solution Approach 2:
The invention addresses the deformation problem by adding a vertical dimension - stacking layers with different thermal expansion properties in the vertical direction rather than trying to control expansion in the lateral plane. This layered vertical structure allows thermal stresses to be absorbed and distributed through the thickness of the device, preventing lateral asymmetrical deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents or reduces asymmetrical deformation of the shaped body, maintaining the light-emitting surface's integrity and stability during temperature fluctuations, ensuring consistent light-emitting angle and mechanical stability.
Implementation Method 1
the shaped body has a coefficient of thermal expansion which is at least three times as large as a coefficient of thermal expansion of the carrier plate and at least three times as large as a coefficient of thermal expansion of the reinforcement layer
Data Source
AI summary
A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.