Relay Apparatus for Storage Midplane Redundancy

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In storage apparatuses, the lack of redundancy in midplanes (MPs) leads to system shutdowns during MP failures, as there is no duplication of MPs, unlike other modules, which can be hot replaced.

Innovation Solution

A relay apparatus is introduced, comprising first and second board modules and a bridge module to communicatively connect them, enabling redundancy and hot replacement of MPs without disrupting the system, with the MP bridge module allowing independent attachment and detachment for maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If midplanes are not duplicated, then device complexity is reduced, but reliability deteriorates because system operation stops during MP failures

Engineering Contradiction:

Improvesystem operation continuityVSAvoidmidplane duplication structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The relay apparatus is divided into multiple independent board modules (first board module, second board module) connected through a bridge module. This segmentation allows individual modules to be replaced without affecting the entire system, enabling hot replacement and maintaining system operation during failures.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A bridge module is introduced as an intermediary component to connect the first and second board modules. This bridge module acts as a mediator that enables communication between modules while allowing independent replacement of each module, thus improving reliability without requiring full system shutdown.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of repair

If midplanes are duplicated for redundancy, then reliability improves through hot replacement capability, but device complexity increases

Engineering Contradiction:

Improvehot replacement capabilityVSAvoidredundant midplane structure

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The system is segmented into independent board modules that can be individually accessed and replaced from the front and/or rear of the housing. This modular segmentation simplifies the replacement process compared to traditional duplicated midplane structures, making hot replacement more easily implementable.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The board modules are designed with universal mounting interfaces that allow modules to be mounted and unmounted from both front and rear of the housing. This multi-directional accessibility provides flexible repair options and simplifies the hot replacement process while maintaining system redundancy.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If bridge module connects multiple board modules, then reliability improves through redundancy, but device complexity increases due to additional connection components

Engineering Contradiction:

Improvecommunication redundancyVSAvoidbridge module connection structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The bridge module combines multiple connection functions into a single integrated component that communicates among multiple board modules. By merging the communication functions into one centralized bridge module, the system achieves reliable inter-module communication without requiring complex point-to-point connections between each module pair.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10581760B2Relay apparatus

Publication Date: 2020.03.03 FUJITSU LTD

AI summary

A relay apparatus includes first and second board modules and a bridge module. The first board module is configured to relay the communications among the plurality of electronic devices, the plurality of electronic devices being connected to the first board module. The second board module is configured to relay the communications among the plurality of electronic devices, the plurality of electronic devices being connected to the second board module. The bridge module is configured to communicatively connect the first board module and the second board module.