Relay Board Segments Power and Control Boards
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Solution Overview
Problem
The integration of DIP-type and surface-mount-type electronic components on a single board requires both flow mounting and reflow mounting methods, leading to increased manufacturing costs due to the need for different soldering techniques and higher costs associated with high-current DIP-type components.
Innovation Solution
A configuration where a relay board, such as the IF conversion board, is used to connect the power supply circuit board with the control board, utilizing surface-mount devices exclusively on the control board and DIP-type components on the power supply board, with the relay board acting as an intermediary to manage voltage and current differences between connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If both DIP-type and surface-mount-type electronic components are mounted on a single board, then the board can accommodate various electronic components, but the manufacturing cost increases due to requiring both flow mounting and reflow mounting methods
Solution Approach 1:
The invention divides the electronic components into two separate boards: a first board for DIP-type components (power supply circuit) and a second board for surface-mount-type components (control circuit). This segmentation allows each board to use a single mounting method (flow mounting for first board, reflow mounting for second board), eliminating the need for dual mounting processes on one board and reducing manufacturing costs.
Solution Approach 2:
The invention introduces a relay board as an intermediary component between the first board (power supply) and second board (control). The relay board includes connectors that interface with both boards, enabling electrical connection while allowing each board to maintain its dedicated mounting method. This intermediary structure resolves the conflict between component versatility and manufacturing simplicity.
2Power
If DIP-type connectors are used on the power supply board, then high current can be handled, but the connector size and pin count must be larger
Solution Approach 1:
The invention separates the high-current power supply function (first board with DIP-type connector) from the low-current control function (second board with surface-mount connector). This allows the DIP-type connector on the first board to have sufficient pin count for high current without constraining the second board's connector design, enabling each connector to be optimized for its specific electrical requirements.
Data Source
AI summary
A first connector is soldered to a first board. A second connector is soldered to a second board. A third connector and a fourth connector are soldered to a relay board. The third connector is connected to the first connector via a first power line. The fourth connector is connected to the second connector via a second power line. A surface to which the first connector is soldered on the first board is opposite to a surface to which the first connector is attached on the first board. A surface to which the second connector is soldered on the second board is a surface to which the second connector is attached on the second board. Only surface-mount devices are used as electronic components soldered to the second board.