Relay Circuit Structure With Separate Cooling Member Heat Path

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Solution Overview

Problem

Conventional heat-dissipating structures for heat-generating components, such as relays, face inefficiencies due to the need for extended bus bars, leading to increased distance and reduced thermal capacity, resulting in suboptimal heat dissipation.

Innovation Solution

A circuit structure that separates the energization bus bar and cooling member, with a heat transfer portion in the cooling member in direct contact with a heat-dissipating body, allowing for efficient heat dissipation without the need for long, thick bus bars, and enabling a more compact and cost-effective design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat-dissipating structure is provided in the intermediate portion of the bus bar, then the bus bar can conduct heat away from the relay, but the distance between the connection portion of the relay and the heat-dissipating portion increases, reducing heat dissipation efficiency

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddistance between relay connection portion and heat-dissipating portion
Core Design Contradiction:
TemperatureVSLength of moving object

Solution Approach 1:

The invention divides the heat dissipation function from the bus bar by introducing a separate cooling member. The bus bar maintains its primary electrical connection function while the cooling member handles heat dissipation through its heat transfer portion that contacts the heat-dissipating body. This segmentation allows the heat-dissipating portion to be positioned optimally near the relay without extending the bus bar length.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cooling member acts as an intermediary between the relay and the heat-dissipating body. It includes a heat transfer portion that directly contacts the heat-dissipating body and a connection portion that connects to the relay, effectively mediating the heat transfer process and enabling efficient heat dissipation without requiring the bus bar to extend far.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the bus bar is extended to provide heat dissipation function, then heat can be dissipated, but the structure becomes more complex and costs increase

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidbus bar structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The invention segments the heat dissipation function from the bus bar structure. The bus bar remains a simple electrical connector while the cooling member, with its heat transfer portion contacting the heat-dissipating body, handles thermal management. This separation simplifies the bus bar design and reduces overall system complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cooling member serves multiple functions: it provides the heat dissipation pathway, connects electrically to the relay, and thermally contacts the heat-dissipating body. This multi-functionality consolidates what would otherwise require separate components, reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal capacity, reduces heat generation, and allows for more efficient heat dissipation, even under sudden large current conditions, while simplifying the design and reducing costs.

Implementation Method 1

a heat transfer portion that is provided in the cooling member, and is in heat-conductive contact with a heat-dissipating body

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11991815B2Circuit structure
Publication Date: 2024.05.21 AUTONETWORKS TECH LTD
  • US11991815B2 patent drawing
  • US11991815B2 patent drawing
  • US11991815B2 patent drawing

AI summary

Provided is a circuit structure having a novel structure that allows heat from a heat-generating component to be dissipated more efficiently. A circuit structure includes: a heat-generating component that generates heat when energized; energization bus bars that are connected to connection portions of the heat-generating component; cooling members that are formed separately from the energization bus bars, and are connected to the connection portions of the heat-generating component along with energization bus bars, and the heat-transfer portions that are provided in the cooling members, and are in heat-conductive contact with a heat-dissipating body.