Relay Conductor Adhesion in Multilayer Ceramic Electronic Components
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Solution Overview
Problem
Existing electronic components with lead-out portions tend to slip off from the multilayer body due to low adhesivity, especially during manufacturing processes like cutting and mounting, leading to potential disconnection issues.
Innovation Solution
The electronic component design incorporates a multilayer body with insulator layers having cut-away portions and relay conductors positioned within these cut-away areas, ensuring high adhesivity with softer insulator layers, which reduces the likelihood of slipping off and disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If lead-out portions are formed directly on the magnetic substrate, then the structure is simple, but the adhesivity is low causing the lead-out portions to slip off
Solution Approach 1:
The patent introduces an intermediary structure (the multilayer body with insulator layers and relay conductors) between the lead-out portions and the magnetic substrate. This intermediary multilayer body provides better adhesivity and mechanical support, preventing the lead-out portions from slipping off while maintaining structural simplicity through integrated design.
Solution Approach 2:
The patent employs composite material structure by combining magnetic substrates with a multilayer body consisting of insulator layers and relay conductors. This composite structure leverages the advantages of different materials: the magnetic substrate provides magnetic properties while the multilayer body provides enhanced adhesivity and electrical insulation, resolving the contradiction between simplicity and reliability.
2Productivity
If impacts are applied during cutting and scribing steps, then the manufacturing process is complete, but peeling-off occurs between the lead-out portion and magnetic substrate
Solution Approach 1:
The patent applies beforehand cushioning by designing the multilayer body with insulator layers and relay conductors that are firmly bonded to the magnetic substrate before the cutting and scribing steps. This pre-reinforced structure cushions against the impacts applied during manufacturing, preventing peeling-off while allowing the manufacturing process to complete.
3Strength
If the magnetic substrate is made hard, then the structural strength is high, but the adhesivity of lead-out portions decreases
Solution Approach 1:
The patent applies local quality by creating different regions with different properties: the magnetic substrate maintains its hard structural strength, while the multilayer body provides a softer, more adhesive interface for the lead-out portions. This local differentiation allows the structure to simultaneously achieve high structural strength and high adhesivity where needed.
Data Source
AI summary
An electronic component includes a first ceramic substrate having a first principal surface on the upper side and a second principal surface on the lower side, a multilayer body constituted by a plurality of insulator layers each made of a material containing resin and laminated on the first principal surface, a first coil disposed in and/or on the multilayer body, a first relay conductor connected to the first coil, and a first outer electrode disposed on the first ceramic substrate and electrically connected to the first relay conductor. The plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion, the first relay conductor is disposed in the first cut-away portion, and the plurality of insulator layers include a second insulator layer that is contacted with the first relay conductor from below.