Relay Pipe Cooling Layout for Multi-Module Casings
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Solution Overview
Problem
In devices with multiple modules mounted in a single casing, the increasing number of pipes for heat medium supply leads to casing compression, potentially raising internal temperatures and requiring larger device sizes to accommodate storage without compression.
Innovation Solution
A cooling device with a supply pipe and a relay member inside the casing that distributes the heat medium in multiple directions to multiple modules, reducing the number of pipes entering and exiting the casing and enhancing storage capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of pipes for supplying heat medium to each module is increased, then each module can be cooled individually, but the inside of the casing is compressed and storage capacity is reduced
Solution Approach 1:
Multiple pipes for supplying heat medium to different modules are merged into a single supply pipe that enters the casing once. Inside the casing, a relay member distributes the heat medium to multiple modules through internal flow channels, eliminating the need for multiple external pipe entries and improving storage capacity while maintaining individual module cooling capability
2Reliability
If pipes are arranged in parallel in the outlet header to supply heat medium to multiple modules, then each module receives heat medium, but the outlet header increases in size and the entire device increases in size
Solution Approach 1:
Instead of arranging pipes in parallel in a single plane (outlet header), the relay member utilizes three-dimensional space within the casing to distribute heat medium. The flow channels are configured in different directions and layers inside the casing, allowing compact heat medium distribution without increasing device footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves storage capacity within the casing by efficiently distributing heat medium to multiple modules, reducing the overall device size and preventing internal temperature increases.
Implementation Method 1
a cooling member that is a member that receives heat from the heat generation member and that cools the heat generation member by using the heat medium
Implementation Method 2
a supply pipe that supplies a heat medium from outside to inside of a casing... distributes the heat medium to each of the plurality of cooling members
Data Source
AI summary
The purpose of the present invention is to provide a cooling device that enable improvement in storage capacity in a casing to which a plurality of modules including heat generation members are mounted. The cooling device includes: a supply pipe that supplies a heat medium from the outside to the inside of a casing having mounted therein a plurality of modules each including an electronic circuit substrate having a heat generation member mounted therein and a cooling member for receiving heat from the heat generation member and for cooling the heat generation member by using the heat medium; and a relay member that includes first flow channels provided inside the casing and allowing the heat medium flowing in from the supply pipe to be delivered to a plurality of directions and that distributes the heat medium to a plurality of the cooling members via the first flow channels.