Semiconductor Relay Module Layout for Stable Switching and Easier PCB Wiring
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Solution Overview
Problem
Existing semiconductor relay configurations face challenges in securing stable operation characteristics and simplifying circuit board design due to complex wiring and difficult circuit design complexities.
Innovation Solution
A semiconductor relay module comprising multiple semiconductor relays with specific input and output circuits connected within a package, allowing for simplified wiring and stable operation by controlling the ON/OFF states of output circuits based on input terminal currents, with MOSFETs and light emitting elements ensuring efficient switching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a common first input circuit controls two output semiconductor relays, then the control structure is simplified, but stable operation characteristics cannot be secured
Solution Approach 1:
The patent divides the control structure into separate input circuits for each semiconductor relay. Specifically, each output semiconductor relay has its own dedicated input circuit, and the grounding semiconductor relay also has its own input circuit. This segmentation allows each relay to be controlled independently, ensuring stable operation characteristics while maintaining a clear and organized control structure.
2Measurement precision
If the first and second input circuits are connected to two input terminals respectively, then the control precision is improved, but the wiring becomes complicated and circuit board design becomes difficult
Solution Approach 1:
The patent merges multiple input circuits into a single integrated semiconductor relay module housing. All input circuits (first input circuit, second input circuit, third input circuit) and output circuits are contained within one module with standardized terminals. This combining approach maintains precise control for each circuit while simplifying the overall wiring structure and making circuit board design easier through modular integration.
3Volume of moving object
If multiple semiconductor relays are integrated in one package, then the device compactness is improved, but the wiring complexity inside the package increases
Solution Approach 1:
The patent arranges the internal wiring and circuit elements in a systematic dimensional layout within the package. Input circuits are positioned to receive signals from input terminals, with clear signal paths leading to respective output circuits. The grounding semiconductor relay is strategically placed between the grounding point and the connection point of output semiconductor relays. This organized spatial arrangement manages internal wiring complexity while maintaining compact integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable operation characteristics and simplifies circuit board design by reducing transmission loss and facilitating easy design, while providing good isolation and insertion loss characteristics.
Implementation Method 1
The photodiode arrays of the two output semiconductor relays are configured to generate electromotive force by the light emission of the first LED to turn on the MOSFETs of the output semiconductor relays
Data Source
AI summary
A first input circuit is connected to a first input terminal and a second input terminal in a package. A second input circuit is connected to the first input terminal and the third input terminal in the package. A third input circuit is connected to the first or second input terminal and a third input terminal in the package. A first output circuit is connected to a first output terminal and a first connection line in the package. A second output circuit is connected to a second output terminal and the first connection line in the package. A third output circuit is connected to a third output terminal and the first connection line in the package.