Relay-Based Substrate Transfer Between Batch and Single-Wafer Processing
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Solution Overview
Problem
Existing substrate processing systems face challenges in seamlessly integrating batch and single-wafer processing capabilities, leading to potential malfunctions and increased design and manufacturing costs due to hardware configuration differences and operational complexities.
Innovation Solution
A substrate processing system is designed with a batch processing apparatus, a single-wafer processing apparatus, and a relay apparatus that connects them, allowing for continuous batch and single-wafer processing by changing substrate attitudes and using conveyance mechanisms to transfer substrates between the two systems, thereby simplifying the configuration and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If batch-type module and single-wafer-type module are integrated in one apparatus, then both merits are achieved, but hardware configuration greatly differs from existing apparatus causing unexpected malfunctions and increased design and manufacturing costs
Solution Approach 1:
The substrate processing system is divided into separate batch processing apparatus and single-wafer processing apparatus, each maintaining their own established hardware configurations. This segmentation allows each apparatus to operate independently with proven designs while still achieving both processing capabilities through the relay apparatus connection.
Solution Approach 2:
A relay apparatus is introduced as an intermediary component to connect the batch processing apparatus and single-wafer processing apparatus. The relay apparatus includes attitude changing mechanisms and conveyance mechanisms that facilitate substrate transfer between the two separate apparatus, enabling integrated functionality without requiring complex integration of the processing modules themselves.
2Adaptability or versatility
If batch-type module and single-wafer-type module are integrated, then both merits are achieved, but operation complexity increases leading to potential malfunctions
Solution Approach 1:
By separating the batch and single-wafer processing into distinct apparatus, each with established operational procedures, the system maintains the operational simplicity of each individual processing type while achieving combined functionality through standardized substrate transfer protocols.
3Adaptability or versatility
If new integrated apparatus is manufactured, then both batch and single-wafer processing are achieved, but design cost and manufacturing cost increase
Solution Approach 1:
The system uses separate batch processing apparatus and single-wafer processing apparatus that can be manufactured using existing, proven designs. This avoids the need to develop and manufacture a completely new integrated apparatus, thereby reducing design and manufacturing costs while still achieving both processing capabilities.
Solution Approach 2:
The relay apparatus serves as a standardized intermediary component that can be manufactured separately and connects the two processing apparatus. This modular approach allows each component to be manufactured using established processes rather than requiring the development of a new integrated system.
Data Source
AI summary
The present invention continuously performs batch processing and single-wafer processing on substrates by connecting a batch processing apparatus and a single-wafer processing apparatus separated from each other by a relay apparatus. With such a configuration, it is possible to relatively easily achieve a substrate processing system capable of continuously performing batch processing and single-wafer processing on substrates by surely utilizing technologies cultivated in individual batch processing-type and single-wafer processing-type apparatuses.