Relay Substrate Protruding Electrodes for Semiconductor Chip Stacking
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Solution Overview
Problem
Conventional semiconductor devices experience significant electrical loss and weakened adhesion due to the use of conductive adhesive agents for fixing the back surface of semiconductor chips at predetermined potentials, with conductive fillers further reducing adhesion strength compared to non-conductive agents.
Innovation Solution
A semiconductor device design that employs a support body with a wiring layer, a first semiconductor chip, a non-conductive adhesion layer, a relay substrate with protruding electrodes, and a second semiconductor chip, where the protruding electrodes penetrate the adhesion layer to connect electrically and apply voltage to the back surface of the second chip, eliminating the need for conductive adhesive agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive adhesive agent is used to bond the back surface of the semiconductor chip to the conductive film on the relay substrate, then the back surface can be fixed at predetermined potential, but electrical loss increases and adhesion strength decreases
Solution Approach 1:
The invention extracts the conductive adhesive agent from the bonding interface between the relay substrate and semiconductor chip. By removing this conductive material, electrical loss is eliminated while adhesion is maintained through mechanical bonding alone, resolving the contradiction between potential fixing reliability and energy loss.
Solution Approach 2:
The invention introduces a non-conductive adhesive agent as an intermediary between the relay substrate and semiconductor chip. This mediator provides both mechanical adhesion and electrical insulation, allowing the conductive film on the relay substrate to fix the back surface potential without requiring conductive bonding material, thus reducing electrical loss while maintaining reliability.
2Reliability
If a conductive adhesive agent is used to bond the back surface of the semiconductor chip, then electrical connection is achieved, but adhesion strength becomes weaker compared to non-conductive adhesive agents
Solution Approach 1:
The invention removes the conductive adhesive agent from the bonding interface, eliminating the compromise between conductivity and adhesion strength. Electrical connection is achieved through the conductive film on the relay substrate rather than through the adhesive, allowing the use of non-conductive adhesive agents that provide superior adhesion strength.
Solution Approach 2:
The non-conductive adhesive agent serves as an intermediary that provides strong mechanical adhesion without compromising electrical connection. The conductive film on the relay substrate acts as the electrical pathway, while the non-conductive adhesive ensures strong bonding between components, resolving the contradiction between electrical connection and adhesion strength.
Data Source
AI summary
A semiconductor device includes a support body provided with a wiring layer that includes a first pad; a first semiconductor chip; a first relay substrate stacked on the first semiconductor chip through a first non-conductive adhesion layer and including a first conductive portion and a first protruding electrode electrically connected to the first conductive portion; a second semiconductor chip stacked on the first relay substrate through a second non-conductive adhesion layer, the first protruding electrode of the first relay substrate penetrating the second non-conductive adhesion layer to be connected to the second semiconductor chip; and a first metal wire formed at the first relay substrate to be connected to the first conductive portion for electrically connecting the first conductive portion with the first pad of the wiring layer of the support body.