Semiconductor Relay Module Terminal Layout for High-Frequency Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor relay module's complex wiring configuration, with LEDs connected via two terminals for each set of MOSFETs, complicates circuit board design and increases the difficulty in designing efficient high-frequency circuits.
Innovation Solution
A semiconductor relay module is designed with a first, second, and third semiconductor relay connected in series, where each relay has a pair of input and output parts connected to corresponding input and output terminals within a package, simplifying the wiring and allowing for compact and efficient circuit board design by reducing cross-wiring and enhancing high-frequency isolation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the LED is connected via two terminals for each set of MOSFETs, then the semiconductor relay can be turned on and off, but the wiring becomes complex and circuit board design becomes difficult
Solution Approach 1:
The patent combines multiple terminal connections into a shared terminal structure. Specifically, the first terminal is shared between the first LED and the second LED, and the second terminal is shared between the third MOSFET and the fourth MOSFET. This merging of terminal functions reduces the total number of external connections required while maintaining the ability to independently control each MOSFET pair, thereby simplifying the wiring complexity without compromising the relay switching function.
2Reliability
If the LED is connected via two terminals for each set of MOSFETs, then the semiconductor relay can be turned on and off, but circuit board design becomes difficult
Solution Approach 1:
The patent merges terminal connections to reduce the number of external pins required. By having the first LED and second LED share the first terminal, and the third MOSFET and fourth MOSFET share the second terminal, the overall terminal count is reduced. This merging approach simplifies the circuit board layout and connection design, making the device easier to manufacture and integrate into larger systems while preserving the full relay switching functionality.
3Reliability
If multiple semiconductor relays are connected in series, then high-frequency isolation is improved, but the wiring configuration becomes more complex
Solution Approach 1:
The patent applies terminal merging to a series configuration of multiple semiconductor relays. By sharing terminals between adjacent relay stages, the patent reduces the number of interconnections required while maintaining the series isolation architecture. This approach preserves the high-frequency isolation benefits of series connection while minimizing the wiring configuration complexity through strategic terminal sharing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration facilitates easier circuit board design by providing each semiconductor relay with dedicated input and output terminals, reducing transmission loss and improving high-frequency isolation and insertion loss properties, enabling more efficient high-frequency signal handling.
Implementation Method 1
By causing a light-emitting diode (LED) to emit light, each photodiode array generates an electromotive force to turn on the connected MOSFET
Data Source
AI summary
In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.