Relay Wiring Exposure Patterning for Chip Positional Deviation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer-level packaging technologies face challenges in dealing with positional deviations of semiconductor chips on a wafer, which affect the accuracy of exposure processes.
Innovation Solution
An exposure apparatus and method that includes a substrate stage, exposure unit, pattern determination unit, and controller to measure and correct positional deviations of semiconductor chips, allowing for precise exposure of relay wiring patterns onto a photosensitive layer while moving the substrate along a uniaxial direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer-level packaging technology is used, then manufacturing efficiency is improved, but positional deviation of semiconductor chips affects exposure accuracy
Solution Approach 1:
The measurement unit measures the position of semiconductor chips before the exposure process to determine positional deviation. The pattern determination unit then determines the exposure pattern based on this measured position, allowing the exposure unit to accurately expose the photosensitive layer despite chip positional deviations, thus maintaining both manufacturing efficiency and exposure accuracy
Solution Approach 2:
The system uses a feedback loop where the measurement unit detects chip position, the pattern determination unit processes this information to determine the appropriate exposure pattern, and the exposure unit executes the exposure accordingly. This feedback mechanism ensures that positional deviations are compensated for, maintaining exposure accuracy while preserving the efficiency of wafer-level packaging
2Device complexity
If positional deviation of semiconductor chips is not corrected, then the manufacturing process is simpler, but exposure pattern accuracy deteriorates
Solution Approach 1:
The pattern determination unit acts as an intermediary between the measurement unit and the exposure unit. It receives position information from the measurement unit, processes this data to determine the appropriate exposure pattern, and transmits control signals to the exposure unit. This intermediary component enables accurate exposure pattern generation without requiring complex real-time adjustments during the exposure process itself
Solution Approach 2:
All necessary corrections for positional deviation are determined in advance before the exposure process. The measurement unit captures chip positions, and the pattern determination unit calculates the required exposure patterns based on these pre-measured positions. This preliminary determination simplifies the overall process by eliminating the need for complex real-time corrections during exposure
3Loss of time
If exposure pattern is determined without measuring chip position, then the measurement process is eliminated, but the ability to compensate for positional deviation is lost
Solution Approach 1:
The measurement unit measures chip position before the exposure process begins, and the pattern determination unit determines the exposure pattern based on this pre-measured position. By performing the measurement and pattern determination in advance, the system avoids the need for time-consuming real-time adjustments during exposure, thus minimizing time loss while maintaining accurate positional deviation compensation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient exposure of relay wiring patterns, addressing positional deviations and enhancing the manufacturing process of semiconductor devices.
Implementation Method 1
an exposure unit configured to radiate an exposure light toward the draw-out electrode provided in an electrode formation area
Data Source
AI summary
An exposure apparatus includes: a substrate stage onto which a substrate is to be mounted; an exposure unit radiating an exposure light toward the draw-out electrode on at least one semiconductor chip; a pattern determination unit determining an exposure pattern; and a controller controlling the substrate stage and the exposure unit. The pattern determination unit determines a pattern of a relay wiring connecting the draw-out electrode and a predetermined position with respect to the substrate, by using an output from a measurement unit to measure a position of the semiconductor chips on the substrate to obtain a positional deviation. The controller exposes the relay wiring pattern onto an exposure area extending, on the photosensitive layer, in the uniaxial direction by the exposure unit, while moving the substrate from a first-side in the uniaxial direction to a second-side opposite to the first-side in the uniaxial direction by the substrate stage.