Releasable Solder Resist Layer for Carrier Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the manufacturing of package carriers, the existing method of removing the carrier from the substrate using etching not only removes the releasable copper foil layer but also etches the wiring layers, leading to reduced product structural reliability and increased manufacturing costs due to additional processing steps.
Innovation Solution
A manufacturing method involving a releasable solder resist layer that temporarily bonds the carrier to the substrate, allowing for easy peeling off without the need for etching, using a combination of thermal-curing and photo-curing solder resist materials to form patterned layers that facilitate separation without damaging the substrate's wiring layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If etching is used to remove the carrier from the substrate, then the releasable copper foil layer can be removed, but the wiring layers on the substrate are also etched, reducing product structural reliability
Solution Approach 1:
The patent introduces a releasable solder resist layer as an intermediary between the carrier and the substrate. This layer enables the carrier to be temporarily bonded to the substrate during manufacturing, then easily peeled off without requiring etching. The solder resist layer acts as a mediator that facilitates separation while protecting the substrate's wiring layers from damage, thus resolving the contradiction between ease of manufacture and product reliability.
2Ease of operation
If etching is used to remove the carrier, then the carrier can be separated from the substrate, but additional processing steps are required, increasing manufacturing costs
Solution Approach 1:
The patent applies preliminary action by forming the releasable solder resist layer on the carrier before bonding to the substrate. This pre-applied layer is designed to be easily removable after serving its temporary bonding function. The solder resist layer is prepared in advance with specific properties that enable easy peeling, thus simplifying the subsequent carrier removal process and reducing manufacturing complexity.
3Strength
If a releasable copper foil layer is used to bond the carrier to the substrate, then the carrier can serve as a support structure, but residual glue remains on the substrate after carrier removal, requiring additional cleaning steps
Solution Approach 1:
The patent changes the material parameter from copper foil to solder resist layer. The solder resist layer has different chemical and physical properties that enable it to be easily removed without leaving residues. By changing the material parameter, the bonding strength is maintained during the manufacturing process, but the removal process becomes simpler and does not require additional cleaning steps, thus resolving the contradiction between bonding strength and ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process by eliminating the need for etching, reduces manufacturing costs, and enhances product reliability by avoiding residual glue issues and protecting the substrate's wiring layers during carrier separation.
Implementation Method 1
forming a releasable solder resist layer includes: forming a solder resist material layer on the connecting surface of the carrier, wherein a material of the solder resist material layer includes a thermal-curing solder resist material and a photo-curing solder resist material; and performing a photo curing process on the solder resist material layer to form the releasable solder resist layer
Implementation Method 2
forming a first patterned solder resist layer includes: forming a first solder resist material layer on the lower surface of the substrate, wherein a material of the first solder resist material layer includes a thermal-curing solder resist material and a photo-curing solder resist material; performing a photo curing process and a thermal curing process on the first solder resist material layer to completely cure the first solder resist material layer
Data Source
AI summary
A manufacturing method of a package carrier is provided. A carrier having a connecting surface is provided. A releasable solder resist layer is formed on the connecting surface of the carrier and completely covers the connecting surface. A substrate having an upper surface and a lower surface opposite to each other is provided. A first patterned solder resist layer is formed on the lower surfaces of the substrate and exposes a portion of the lower surface. The carrier and the substrate are laminated, the releasable solder resist layer directly contacts the first patterned solder resist layer, and the carrier is temporarily bonded to the first patterned solder resist layer through the releasable solder resist layer.