Release Agent Composition for Semiconductor Devices
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Solution Overview
Problem
Conventional release agents for semiconductor devices, such as silicone compounds, migrate and cause defects, while alternative agents like alkyd resin, olefin resin, and long chain alkyl resin release agents suffer from limitations in peel strength, heat resistance, and solvent resistance, making it difficult to achieve suitable adhesion and release properties.
Innovation Solution
A release agent composition comprising poly(meth)acrylate and a liquid polymer with reactive functional groups, along with a crosslinking agent, which forms a semi-IPN structure to enhance solvent resistance, heat resistance, and adhesion to substrates, while controlling peel strength and avoiding the use of silicone compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicone compound release agent is used, then release properties are improved, but the silicone compound migrates to the pressure sensitive adhesive layer causing defects on semiconductor device circuits
Solution Approach 1:
The invention extracts and eliminates the harmful silicone compound component from the release agent system while maintaining the essential release function through alternative long chain alkyl group-containing poly(meth)acrylate polymers that do not migrate to the adhesive layer
Solution Approach 2:
The invention uses composite material structures by combining poly(meth)acrylate polymer chains with long chain alkyl groups that provide release properties through physical adsorption mechanisms rather than chemical bonding, preventing migration while maintaining reliability
2Reliability
If an alkyd resin release agent is used, then release properties are improved, but peel strength becomes too high limiting use on adhesives
Solution Approach 1:
The invention changes the chemical parameter of the polymer structure by using poly(meth)acrylate with long chain alkyl groups instead of alkyd resin, which fundamentally alters the interaction mechanism from strong chemical adhesion to weaker physical adsorption, thereby reducing peel strength while maintaining release properties
3Ease of manufacture
If an olefin resin release agent is used, then ease of manufacture is improved, but heat resistance becomes inferior preventing formation of pressure sensitive adhesive layer
Solution Approach 1:
The invention changes the thermal parameter by selecting poly(meth)acrylate polymers with higher glass transition temperatures and thermal stability compared to olefin resin, enabling the material to withstand the heat required for pressure sensitive adhesive layer formation while remaining easy to manufacture through standard coating and drying processes
4Stability of the object's composition
If a long chain alkyl group-having acryl resin release agent is used, then solvent resistance is improved, but adhesion to substrate such as films becomes inferior and pressure sensitive adhesive agent cannot be applied
Solution Approach 1:
The invention applies local quality by having different regions of the polymer structure serve different functions: the poly(meth)acrylate backbone provides solvent resistance and structural stability, while the long chain alkyl groups provide controlled adhesion to the substrate and pressure sensitive adhesive layer, achieving both requirements simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent solvent resistance, heat resistance, and adhesion to substrates, enabling the formation of a suitable release layer for semiconductor devices without the migration issues associated with silicone compounds, and allows for controlled peel strength for various applications.
Implementation Method 1
a crosslinking agent (C), wherein at least one of the poly(meth)acrylate (A) and the liquid polymer (B) has a reactive functional group, and the crosslinking agent (C) is a compound having a functional group capable of reacting with the reactive functional group
Implementation Method 2
the freedom of the long chain alkyl group is decreased so that the surface energy of a release layer is hard to be lowered
Data Source
AI summary
A release agent composition includes a poly(meth)acrylate (A) containing a structural unit (1) represented by the following formula (1);in which R1 represents hydrogen or a methyl group and R2 represents a long-chain alkyl group having 12 to 28 carbon atoms, a liquid polymer (B) and a crosslinking agent (C), wherein at least one of the poly(meth)acrylate (A) and the liquid polymer (B) has a reactive functional group, and the crosslinking agent (C) is a compound having a functional group capable of reacting with the reactive functional group.