Release Layer Transfer Using Separate Heat and Actinic Light

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Solution Overview

Problem

Existing methods for transferring microelectronic components from one surface to another are limited by the size of systems that can be made in one integrated parallel process and require further advances in packaging techniques, particularly for heterogeneous packaging of different integrated technologies.

Innovation Solution

A process involving a release layer that is degraded using separate sources of heat and actinic light within a pulse period, allowing for the transfer of components ranging from microns to centimeters in size, reducing power and energy requirements, and eliminating the need for lasers in some cases, while providing controlled kinetics and two-step mechanical implementation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If serial pick-and-place or laser ablation techniques are used for component transfer, then component placement can be achieved, but scalability and throughput are limited

Engineering Contradiction:

Improvecomponent transfer throughputVSAvoidprocessing system complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the component transfer process into distinct functional layers: a release layer adhered to components, a middle layer providing mechanical support, and a bottom layer forming the donor substrate. This segmentation allows parallel processing of multiple components simultaneously while maintaining individual component integrity, thereby improving throughput without proportionally increasing system complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The multi-layer structure serves multiple functions simultaneously: the release layer enables component release through decomposition, the middle layer provides mechanical support during handling, and the bottom layer serves as the donor substrate. This multi-functionality allows a single integrated structure to perform what would otherwise require multiple separate systems, improving productivity while controlling device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If heating to decomposition temperature is applied to the release layer, then component transfer is enabled, but energy consumption increases

Engineering Contradiction:

Improvecomponent transfer efficiencyVSAvoidheating energy requirement

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent changes the chemical composition parameters of the release layer to include materials with lower decomposition temperatures and higher decomposition rates. By selecting specific polymer compositions and additives, the release layer decomposes more readily under reduced thermal energy input, enabling efficient component transfer while reducing the overall energy consumption of the heating process

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The release layer is formulated as a composite material combining polymers with specific decomposition characteristics and optional additives. This composite structure provides both the necessary adhesion properties for component mounting and the controlled decomposition behavior needed for efficient release at reduced temperatures, thereby improving transfer efficiency while minimizing energy consumption

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient transfer of microelectronic components with improved control over reaction kinetics, reduced power consumption, and eliminates the need for lasers in the imaging system, facilitating the integration of diverse technologies in packaging.

Implementation Method 1

heating the release layer from a heating source to at least a decomposition temperature, wherein the heating is selected from the group consisting of a conductive heating, a radiative heating

Methodology Applied

Scientific EffectRadiative heating: Absorption (EM radiation)

Implementation Method 2

heating the release layer from a heating source to at least a decomposition temperature... wherein the heating and exposing steps degrade the release layer

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 3

exposing the release layer to an actinic wavelength of light from an actinic irradiation source; wherein the heating and exposing steps degrade the release layer

Methodology Applied

Scientific EffectPhotochemical decomposition: Photodissociation

Data Source

PatentUS12596306B2Photochemical and thermal release layer processes and uses in device manufacturing

Publication Date: 2026.04.07 TERECIRCUITS CORP

AI summary

A process for transferring a component from a release layer by exposing the release layer to light and heat from different sources is described. The process includes providing an assembly comprising a substrate, a release layer and a component, heating the release layer and exposing the release layer to an actinic wavelength of light, wherein the heating source and the actinic irradiation source are different sources.