Releasing Layer for Flexible Device Manufacturing
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Solution Overview
Problem
Conventional methods for manufacturing flexible devices face challenges in achieving a balance between adhesiveness and releasability of the support with the flexible substrate, leading to instability and increased costs due to complex processes and high equipment costs, as well as issues with adhesiveness and heat resistance of materials like COC.
Innovation Solution
A flexible device manufacturing method involving the formation of a releasing layer using a solution containing alkylsilane alkoxide derivative and titanium alkoxide derivative, with controlled baking temperatures and ratios, to achieve a balanced adhesiveness and releasability, reducing the need for multiple layers and vapor-phase processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesiveness of the support with the flexible substrate is high, then the flexible substrate is stable during device formation, but the releasability is low requiring strong force that may break the device
Solution Approach 1:
The support structure is segmented into multiple layers: a support substrate and a releasing layer. This segmentation allows the support substrate to provide stability during device formation while the releasing layer enables easy release, resolving the contradiction between adhesiveness and releasability.
Solution Approach 2:
The releasing layer acts as an intermediary between the support substrate and the flexible substrate. It mediates the interaction by providing controlled adhesiveness during device formation and controlled releasability after device formation, eliminating the need for strong release forces that could damage the device.
2Ease of operation
If the adhesiveness of the support with the flexible substrate is low, then the releasability is high, but the flexible substrate is unstable and difficult to form device on
Solution Approach 1:
The support structure is segmented into multiple layers: a support substrate and a releasing layer. This segmentation allows the support substrate to provide stability during device formation while the releasing layer enables easy release, resolving the contradiction between adhesiveness and releasability.
Solution Approach 2:
The releasing layer acts as an intermediary between the support substrate and the flexible substrate. It mediates the interaction by providing controlled adhesiveness during device formation and controlled releasability after device formation, eliminating the need for strong release forces that could damage the device.
3Ease of operation
If a two-layer releasing layer is used between support and flexible substrate, then releasability is improved, but the process complexity and manufacturing cost increase
Solution Approach 1:
The releasing layer combines multiple functions into a single layer: it provides releasability, serves as a barrier film, and can be formed through a simplified coating and heating process. This merging reduces the number of separate layers and processes needed compared to conventional two-layer releasing layer structures.
Solution Approach 2:
The releasing layer's properties are optimized by controlling the baking temperature and composition ratios during formation. By adjusting these parameters, the layer achieves the desired balance between adhesiveness and releasability without requiring complex multi-layer structures.
4Ease of operation
If conventional releasing layer materials like COC are used, then releasability is achieved, but heat resistance and dimensional stability are insufficient
Solution Approach 1:
The releasing layer is formed from a composite composition containing both silane-based compounds and acrylic compounds. This composite material provides both the releasability needed for easy substrate release and the heat resistance required for withstanding device formation processes, overcoming the limitations of conventional single-material releasing layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the easy release of flexible devices without excessive force, maintaining device integrity and substrate stability, while reducing process complexity and costs, and providing heat resistance and dimensional stability.
Implementation Method 1
forming a thin film by coating a surface of a support with a predetermined solution in a state where hydroxyl groups are present on the surface; forming a releasing layer by baking the thin film
Implementation Method 2
a baking temperature for baking the thin film in the forming the releasing layer is at least 200° C. and at most 350° C.
Implementation Method 3
forming a thin film by coating a surface of a support with a predetermined solution in a state where hydroxyl groups are present on the surface
Data Source
AI summary
Flexible device manufacturing method including: forming thin film by coating surface of support with predetermined solution in state where hydroxyl groups are present on surface; forming releasing layer by baking thin film; forming flexible substrate on releasing layer; forming device on flexible substrate; and releasing releasing layer, flexible substrate and device from support at interface between support and releasing layer. Predetermined solution contains alkylsilane alkoxide derivative and titanium alkoxide derivative. Baking temperature for baking thin film is at least 200° C. and at most 350° C. Ratio of number of silicon atoms in alkylsilane alkoxide derivative to number of titanium atoms in titanium alkoxide derivative is 3.3:1 to 4.1:1 when baking temperature is at least 200° C. and less than 270° C., 3.3:1 to 23:1 when baking temperature is at least 270° C. and at most 330° C., and 19:1 to 23:1 when baking temperature is more than 330° C. and at most 350° C.