Relief Pattern Transfer Apparatus for Embossed Film Production
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Solution Overview
Problem
Conventional methods for producing films with fine relief patterns suffer from defects such as air bubbles and increased complexity in production due to air entering between the cured resin film and the plate cylinder, and the formation of structure layers on entire surfaces leads to design constraints and risks of breaking or cracking during punching or cutting.
Innovation Solution
A method involving printing a transfer pattern onto a first substrate with a relief-structure pattern using ionizing radiation-curable resin, drying, laminating a second substrate, curing with ionizing radiation, and peeling to form an inverted structure on the second substrate, utilizing a feeder, printer, dryer, laminator, curing, and separating sections in an apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer speed of the film is increased to improve productivity, then production efficiency increases, but air enters between the cured resin film and the plate cylinder causing defects such as air bubbles on the film surface
Solution Approach 1:
The resin is applied onto the film surface in advance before the transfer process, and the film is pre-positioned between the plate cylinder and impression cylinder. This preliminary preparation ensures that when high-speed transfer occurs, the resin is already in place and properly distributed, preventing air from entering and causing bubbles even at increased transfer speeds.
Solution Approach 2:
The patent changes the physical state and properties of the resin by controlling its viscosity and curing characteristics. The resin is formulated to remain workable during high-speed transfer but then cure rapidly under UV irradiation, allowing the process to maintain both high speed and high quality without air bubble defects.
2Manufacturing precision
If a retention portion is added to the plate cylinder to spread and retain resin, then resin distribution improves, but the process becomes more complex and requires more complicated control of production conditions
Solution Approach 1:
The patent removes the complex retention portion structure from the plate cylinder and extracts the resin distribution function to a separate coating device. This simplifies the plate cylinder to its essential function of providing the relief pattern, while the coating device independently handles resin application and distribution, reducing overall system complexity and easing control requirements.
3Reliability
If a structure layer is formed on the entire surface of the film, then optical effects are enhanced, but design flexibility decreases and risks of breaking or cracking increase during punching or cutting
Solution Approach 1:
The patent applies the structure layer only in specific local areas where optical effects are needed, rather than covering the entire film surface. This selective application maintains high optical quality in required zones while leaving other areas flat and flexible, enabling punching and cutting operations without cracking and allowing diverse design configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of relief-patterns with higher quality and productivity, reducing defects and allowing for partial structure application, thus enhancing design flexibility and reducing material usage and risks of cracking.
Implementation Method 1
curing the printed transfer pattern by irradiating ionizing radiation
Data Source
AI summary
A method and an apparatus for producing a relief-pattern forming, the method and apparatus being suitable for producing a film-like material, such as an embossed film, having a fine relief-structure pattern formed on a surface thereof so as to have a distinctive optical effect with higher quality, good productivity, and fewer defects. A transfer pattern printed layer having an inverted structure of a relief-structure pattern is formed on a second substrate by printing a transfer pattern onto the surface of a first substrate on which the relief-structure pattern is formed at a predetermined position by registration with the relief-structure pattern followed by drying, laminating with the second substrate, curing and peeling.