Remapped Extracted Die Interposer Pinout Adaptation
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in repackaging extracted dice into new packages with different pinouts and temperature ranges, particularly for military and environmental applications, where commercial-grade plastic packages are insufficient for demanding conditions.
Innovation Solution
A remapped extracted die is created by bonding an interposer to the extracted die, which includes reconditioned bond pads with nickel, palladium, and gold layers, allowing new bond wires to be attached to match the desired pin assignments of a new package base, enabling the dice to be repackaged into various hermetic or non-hermetic packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If extracted dice are repackaged into new packages with different pinouts, then adaptability and versatility are improved, but device complexity increases due to the need for interposers and remapping configurations
Solution Approach 1:
An interposer is introduced as an intermediary component between the extracted die and the new package base. The interposer contains bond pads that are electrically coupled to accommodate different pin assignments, serving as a mediator that enables compatibility between the original die and the new package configuration without requiring modification to the die itself.
Solution Approach 2:
The packaging system is segmented into distinct functional components: the extracted die, the interposer with remapped bond pads, and the new package base. This segmentation allows each component to be optimized independently and facilitates the remapping function by separating the die from the package configuration.
2Productivity
If extracted dice are reused in new packages, then productivity and cost-effectiveness are improved, but reliability may worsen due to potential degradation from extraction and repackaging processes
Solution Approach 1:
The bond pads on the extracted die are reconditioned through chemical etching and plating processes that modify their surface parameters. This restores the electrical and mechanical properties of the bond pads, ensuring they can form reliable new bonds despite the die having been previously extracted and used.
Solution Approach 2:
The bond pads are reconditioned in advance before the die is mounted in the new package. This preliminary restoration of the bond pad surfaces ensures that when new bond wires are attached, the connection reliability is equivalent to that of a newly manufactured die.
3Reliability
If bond pads are reconditioned with multiple metal layers, then reliability and bondability are improved, but manufacturing complexity and process time increase
Solution Approach 1:
The bond pads are constructed as composite structures with multiple metal layers, typically including a copper core for electrical conductivity, a nickel intermediate layer for adhesion and diffusion barrier, and a gold outer layer for oxidation resistance and bondability. This composite structure provides superior reliability compared to single-layer pads.
Solution Approach 2:
The multi-layer metal structure is applied specifically to the bond pad regions where electrical connections are made, rather than throughout the entire die. This localized treatment provides enhanced reliability at the critical connection points while minimizing the overall complexity and cost.
4Adaptability or versatility
If interposers are used to remap bond pads, then adaptability to different packages is improved, but loss of substance increases due to additional materials required
Solution Approach 1:
The interposer is designed as a universal component that can accommodate multiple die types and package configurations. By creating a standardized interposer with a specific pinout configuration, the same interposer design can be used with different extracted dies and mounted in various package bases, reducing the need for custom interposers for each application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the reuse of extracted dice in new packages, providing reliability across broader temperature ranges and enabling the creation of packaged integrated circuits suitable for military and environmental applications, even when original dice or wafers are unavailable.
Implementation Method 1
an interposer, bonded to the extracted die
Data Source
AI summary
A remapped extracted die is provided. The remapped extracted die includes an extracted die removed from a previous integrated circuit package. The extracted die includes a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and an interposer, bonded to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads, and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.