Remoldable Bismaleimide Resin via Dynamic Disulfide Bonds
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Solution Overview
Problem
Traditional thermosetting resins are not remoldable due to their covalent cross-linking network, limiting their recycling and reuse, and existing remoldable thermosetting resins suffer from low comprehensive performance in terms of heat resistance and mechanical strength.
Innovation Solution
A remoldable bismaleimide resin is developed through a method involving the synthesis of bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate in the presence of a quaternary ammonium salt, followed by reaction with bismaleimide and a zinc compound, and subsequent curing and post-treatment to achieve high heat resistance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional thermosetting resins are used to ensure high mechanical strength and heat resistance, then structural stability is improved, but remoldability and recyclability deteriorate
Solution Approach 1:
The patent applies dynamics by introducing dynamic covalent bonds (disulfide bonds) into the thermosetting resin network. These bonds can reversibly break and reform under specific conditions (heat and catalyst), transforming the traditionally static cross-linked network into a dynamic system that allows chain segment movement and remolding while maintaining overall structural integrity and mechanical properties
Solution Approach 2:
The patent changes the chemical parameter of the cross-linking bonds from permanent covalent bonds to reversible dynamic covalent bonds (disulfide bonds). This parameter change enables the resin to transition between a fixed cross-linked state (providing strength) and a mobile state (allowing remolding) through controlled chemical reactions, resolving the contradiction between structural stability and remoldability
2Adaptability or versatility
If remoldable thermosetting resins are developed to enable recycling and reshaping, then remoldability is improved, but heat resistance and mechanical strength deteriorate
Solution Approach 1:
The patent creates a composite resin system combining epoxy resin with disulfide-containing modifiers and catalysts. This composite structure integrates the high strength and heat resistance of epoxy resin with the remoldability of dynamic covalent bond networks, achieving both mechanical performance and recyclability simultaneously
Solution Approach 2:
The patent introduces a catalyst (such as dibutyltin dilaurate) as an intermediary that mediates the exchange reaction of disulfide bonds. The catalyst enables controlled bond rearrangement at moderate temperatures without compromising the overall network integrity, allowing remolding while preserving mechanical strength and heat resistance
3Reliability
If remoldable thermosetting resins are developed to enable recycling, then environmental sustainability is improved, but comprehensive performance deteriorates
Solution Approach 1:
The patent implements discarding and recovering by enabling the thermosetting resin to be discarded (pulverized) and recovered (remolded) through the dynamic disulfide bond exchange mechanism. The resin can be processed multiple times while maintaining performance, achieving environmental sustainability without sacrificing mechanical strength or heat resistance
Solution Approach 2:
The patent applies self-service through the self-healing capability of the disulfide bond network. The dynamic bonds automatically rearrange and reform broken cross-links through exchange reactions, enabling the material to self-repair and maintain its mechanical properties after remolding without external intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The remoldable bismaleimide resin exhibits improved heat resistance with an initial thermal decomposition temperature of 375°C, glass transition temperature of 203°C, tensile strength of 84 MPa, and tensile modulus of 3233 MPa, along with good shape memory performance and the ability to be reshaped through hot pressing.
Implementation Method 1
In the presence of a quaternary ammonium salt, bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate is synthesized by reacting 2-allylphenyl glycidyl ether and terephthalic acid
Implementation Method 2
Remoldable bismaleimide resin system is synthesized by reacting bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate, bismaleimide, and a zinc compound
Implementation Method 3
The remolded bismaleimide resin is prepared with remoldable bismaleimide resin being pulverized and hot pressing treated to realize the remolding of the bismaleimide resin
Data Source
AI summary
A remoldable bismaleimide resin and application thereof. The preparation method includes blending 2-allylphenyl glycidyl ether and terephthalic acid in acetonitrile, carrying out an esterification reaction under the condition of quaternary ammonium salt as a catalyst to obtain bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate containing a reversible dynamic group; then uniformly mixing bis(3-(2-allylphenoxy)-2-hydroxypropyl) terephthalate and bismaleimide, curing to obtain the re-moldable bismaleimide resin. The prepared re-moldable bismaleimide resin not only has excellent heat resistance and mechanical properties, but also can be remolded under hot pressing conditions. The preparation method of the re-moldable bismaleimide resin has the advantages of wide raw material sources and simple process, and has a wide application prospect in the fields of aerospace, transportation, electronic information, new energy, insulated electrical industry and the like.