Remote Diode Temperature Sensing Circuit for Burn-In Testing
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Solution Overview
Problem
Conventional semiconductor devices require dedicated temperature sensing package pins for burn-in testing, which are costly and inefficient as they serve no purpose after testing, and estimating device temperature without these pins can be inaccurate due to unknown power usage and thermal resistance.
Innovation Solution
A remote diode temperature sensing circuit that uses an I/O package pin to measure the temperature of a semiconductor device during burn-in testing by generating temperature sense currents, driving mirrored currents through a diode, and measuring voltage differences to produce a temperature output signal, allowing for direct temperature measurement without additional pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If dedicated temperature sensing package pins are included in semiconductor devices, then temperature measurement accuracy during burn-in testing is improved, but device cost and complexity increase
Solution Approach 1:
The invention repurposes existing I/O package pins to serve dual functions: normal input/output operations during device operation and temperature sensing during burn-in testing. The adapter circuit enables the temperature sense circuit to utilize these general-purpose pins for temperature measurement, eliminating the need for dedicated temperature sensing pins while maintaining measurement accuracy.
2Measurement precision
If dedicated temperature sensing package pins are included in semiconductor devices, then temperature measurement accuracy during burn-in testing is improved, but manufacturing cost increases
Solution Approach 1:
The invention eliminates dedicated temperature sensing pins by making existing I/O pins multi-functional. The adapter circuit allows the temperature sense circuit to use general-purpose I/O pins for temperature measurement during burn-in testing, reducing the total pin count required and lowering manufacturing costs while maintaining temperature measurement capability.
3Device complexity
If external temperature sensing is used without dedicated pins, then device complexity is reduced, but temperature measurement accuracy deteriorates due to unknown power usage and thermal resistance
Solution Approach 1:
The adapter circuit serves as an intermediary between the temperature sense circuit and the I/O pins. It translates the temperature sense currents from the temperature sense circuit into appropriate current levels for driving the diode, and translates the voltage measurements back to the temperature sense circuit, enabling accurate temperature measurement through general-purpose pins without requiring knowledge of power usage or thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and cost-effective direct temperature measurement of semiconductor devices during burn-in testing, reducing waste and complexity by utilizing existing I/O pins for temperature sensing, and improving reliability without the need for dedicated temperature sensing pins.
Implementation Method 1
An accurate temperature reading can then be obtained for the device based on the applied currents and the voltage across the diode during application of the currents
Data Source
AI summary
A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.