Remote Active Phase-Change Cooling System with Modular Solid-State Connector
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Solution Overview
Problem
Current electronic component cooling methods face limitations in size and weight, leading to insufficient heat dissipation, and exposure to cooling fluids poses a risk of component failure.
Innovation Solution
An active phase-change cooling system using a modular solid-state connector loop, where a fluid undergoes phase change due to pressure and temperature changes to absorb heat from electronic components, with a compressor-driven process and insulative materials to prevent fluid exposure, allowing for remote heat exchanger placement and increased cooling capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct surface contact cooling is used, then heat extraction efficiency is improved, but the surface area of the heat exchanger is limited by dimensional constraints
Solution Approach 1:
The patent transitions from direct surface contact cooling to remote fluid-based cooling, effectively moving the heat exchanger from the same dimensional space as the electronic component to a remote location. The cooling fluid carries heat away through three-dimensional space via convection, bypassing the surface area limitations of direct contact methods.
2Quantity of substance
If fluid heat exchangers are used, then thermal capacity is increased, but the risk of fluid leakage and component failure increases
Solution Approach 1:
The patent extracts the cooling fluid from direct contact with the electronic component, placing it only in contact with the heat exchanger surfaces. The fluid circulation system is separated from the electronic component housing, eliminating the risk of fluid leakage onto sensitive electronics while maintaining the thermal capacity benefits of fluid-based cooling.
3Productivity
If more cooling material is used, then heat dissipation capacity is improved, but weight and size limitations are exceeded
Solution Approach 1:
The patent employs a fluid circulation system (hydraulic/pneumatic approach) to transport heat away from the electronic component. The cooling fluid circulates through a remote heat exchanger, allowing high heat dissipation capacity without requiring heavy solid cooling materials to be mounted directly on the component. This reduces both weight and size of the cooling system at the component location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation capacity while preventing fluid exposure, overcoming size and weight constraints, and ensuring safe operation by maintaining a lower operating temperature and increased thermal efficiency.
Implementation Method 1
a fluid undergoes phase change due to pressure and temperature changes to absorb heat from electronic components
Implementation Method 2
Phase change heat extraction is a cooling method which works by manipulating a chosen fluid to achieve the most heat capacity
Implementation Method 3
with a compressor-driven process
Implementation Method 4
with insulative materials to prevent fluid exposure
Implementation Method 5
remotely located heat exchanger
Implementation Method 6
fluid is pumped into contact with this metal interface, then pumped to another larger metallic heat exchanger
Data Source
AI summary
An active phase change cooling system and modular connector for heat transportation consisting of: two heat exchangers, a compressor, a flow limiting orifice, a heat source surface transfer component, a heat transfer plate to deliver heat to the heat exchanger and a modular connectors bridging the gap between the heat source and the heat exchanger. Packaged in a mostly sealed environment where heat is delivered to the fluid and via directed air flow, excess heat is exhausted to the external environment.