Remote Phosphor LED Package Heat Dissipation
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Solution Overview
Problem
Existing LED package structures suffer from poor heat dissipation, leading to increased chip temperature, shortened adhesive life, and reduced light conversion efficiency, due to flat bases with small heating areas and inadequate separation between the LED chip and phosphor layer.
Innovation Solution
A high-power remote phosphor white LED heat-dissipation package is designed with a substrate, heat conducting ring, condenser lens, and phosphor structural layer containing hollow glass microspheres, which enhances heat dissipation by creating a cavity structure and increasing the heating area, while improving light uniformity and reducing silica gel usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a flat base is used for heat dissipation in existing LED packages, then the structure is simple, but the heating area is small and heat dissipation performance is poor
Solution Approach 1:
The invention transitions from a flat two-dimensional base to a three-dimensional cavity structure with vertical walls and bottom surface. This dimensional change dramatically increases the heat dissipation surface area, allowing heat to be conducted away from the chip through both the vertical wall surfaces and the bottom surface of the cavity, thereby resolving the contradiction between structural simplicity and heat dissipation performance.
Solution Approach 2:
The base is segmented into distinct functional regions: a vertical wall portion that provides lateral heat dissipation surface and a bottom surface that provides additional heat conduction path. This segmentation allows each portion to contribute independently to heat dissipation, increasing overall effectiveness without requiring a completely complex structure.
2Volume of moving object
If the phosphor layer is placed close to the LED chip, then the package structure is compact, but the chip and phosphor layer mutually heat each other causing poor heat dissipation
Solution Approach 1:
The invention introduces a heat insulation layer as an intermediary substance between the LED chip and the phosphor layer. This intermediary material has low thermal conductivity, which blocks the direct thermal pathway between the hot chip and the phosphor layer, preventing mutual heating while allowing the package to remain compact. The heat insulation layer fills the space efficiently without requiring large separation distances.
3Ease of operation
If packaging adhesive is used to fill the space between phosphors and LED chip, then the phosphors and chip are separated, but the adhesive is in direct contact with the chip causing shortened service life or carbonization
Solution Approach 1:
The heat insulation layer serves as a protective intermediary between the LED chip and the packaging adhesive. This layer prevents the adhesive from directly contacting the chip surface, thereby eliminating the carbonization and degradation problems that occur when adhesive is exposed to high chip temperatures. The heat insulation layer allows the adhesive to remain in place for phosphor positioning while protecting it from thermal damage.
4Illumination intensity
If hollow glass microspheres are added to the phosphor structural layer, then light uniformity is improved, but the device complexity increases
Solution Approach 1:
The phosphor structural layer is formulated as a composite material system containing phosphors, silica gel, and hollow glass microspheres. The hollow glass microspheres serve multiple functions: they act as spacers to maintain phosphor distribution uniformity, provide light scattering centers to improve spatial chroma uniformity, and add structural integrity to the phosphor layer. This composite approach achieves improved optical performance through material composition rather than complex structural arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from both the chip and phosphor layer, maintains stable white light output, and extends the service life of the LED package by improving heat dissipation efficiency and reducing costs.
Implementation Method 1
The phosphor structural layer of the package structure contains hollow glass microspheres. The white LED heat-dissipation package structure in the present invention improves the spatial chroma uniformity of the white light by using the hollow glass microspheres
Implementation Method 2
The substrate of the package structure is provided with a boss and a heat conducting ring
Implementation Method 3
an inner wall of the blind hole (12) is a reflective surface; the inner circumferential surface of the annular protrusion (31) is an inclined reflective surface
Implementation Method 4
The condenser lens (5) is a hemispherical lens, and a flat side of the condenser lens (5) faces towards the blind hole (12) and covers an opening of the blind hole (12)
Data Source
AI summary
High-power remote phosphor white LED heat-dissipation package relates to an LED heat-dissipation package, for solving the problem of poor heat dissipation of LED package structures. The substrate of the package structure is provided with a boss and a heat conducting ring, and the phosphor structural layer contains hollow glass microspheres. The white LED heat-dissipation package structure in the present invention improves the spatial chroma uniformity of the white light by using the hollow glass microspheres, thereby reducing the costs. The package structure can improve the heat dissipation efficiency of the chip and the utilization ratio of light emitted from the chip. The present invention is applicable to prepare high-power remote phosphor white LEDs.