Remote Plasma Source With Intersecting Dielectric Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing remote plasma systems for semiconductor processing are inefficient in gas utilization and require high power, leading to costly and wasteful cleaning processes, with bulky designs that limit the proximity of the plasma source to the processing chamber.
Innovation Solution
A compact remote plasma source with a dielectric body and monopole antenna, featuring a housing with intersecting holes to maximize gas breakdown efficiency and minimize plasma volume, allowing for improved gas flow and reduced power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high power and high flow rates are used in remote plasma cleaning processes, then cleaning effectiveness is improved, but gas utilization efficiency deteriorates and operating cost increases
Solution Approach 1:
The plasma source is divided into multiple discharge cells arranged in series, where each cell contributes to the overall plasma generation. This segmentation allows the total power to be distributed across multiple stages, improving the efficiency of gas utilization while maintaining high cleaning effectiveness through cumulative plasma action.
Solution Approach 2:
The invention transitions from a single-volume plasma source to a linear array of discharge cells extending along the gas flow path. This dimensional change from a compact 3D source to an elongated 1D structure increases the surface area for plasma-gas interaction, improving utilization efficiency while maintaining cleaning effectiveness.
2Quantity of substance
If microwave plasma sources are used for remote plasma generation, then plasma density is improved, but device size increases and proximity to processing chamber is reduced
Solution Approach 1:
The microwave plasma source is segmented into multiple compact discharge cells rather than using a single large-volume source. Each cell generates plasma at high density locally, and the series arrangement maintains overall high plasma density while keeping the total device footprint small, enabling closer placement to the processing chamber.
Solution Approach 2:
The discharge cells utilize thin dielectric barriers and compact microwave coupling structures that enable high plasma density in a minimal volume. This allows the plasma source to be positioned closer to the processing chamber while maintaining high plasma density for effective cleaning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances gas utilization efficiency, reduces power requirements, and enables a more compact design that allows for closer placement of the plasma source to the processing chamber, resulting in a more efficient and cost-effective cleaning process.
Implementation Method 1
microwave plasma source
Implementation Method 2
monopole antenna extending into the dielectric body
Implementation Method 3
dielectric body with a top surface, a bottom surface, and sidewall surfaces
Implementation Method 4
Atomic fluorine is highly reactive and reacts with the material deposited on the chamber walls to form a volatile product
Data Source
AI summary
Embodiments disclosed herein include a plasma source. In an embodiment, a plasma source comprises a dielectric body with a top surface, a bottom surface, and sidewall surfaces. In an embodiment, a plurality of holes pass through the dielectric body, where a first set of holes pass from the top surface to the bottom surface, and a second set of holes pass between opposite sidewall surfaces. In an embodiment, a housing is around the dielectric body, and a monopole antenna extending into the dielectric body.