Remote Plasma Gas Shielding for Ion-Free ALD Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In plasma ALD processes, ions and electrons from the remote plasma method can leak into the processing space, causing discharge and damage to the substrate or processing chamber components.
Innovation Solution
A plasma processing apparatus with a perforated plate featuring through-holes and ion shielding members that block ion passage while allowing activated processing gas to pass through, using ion shielding surfaces to intercept incoming ions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a remote plasma method is used to activate processing gas, then reactivity of the processing gas is enhanced and process temperature is lowered, but ions and electrons leak into the processing space causing discharge and damage to substrate or chamber components
Solution Approach 1:
An ion shielding member is introduced as an intermediary component between the plasma generation space and processing space. This member includes an ion shielding surface that intercepts ions before they can leak into the processing space, while allowing activated processing gas to pass through. The ion shielding member acts as a mediator that blocks harmful ions while permitting beneficial activated gas to reach the substrate.
Solution Approach 2:
The device is segmented into distinct functional zones: a plasma generation space for activating the processing gas, a separation region with the ion shielding member that blocks ions, and a processing space where only activated gas reaches the substrate. This segmentation allows independent optimization of plasma generation and substrate processing while preventing harmful ion contamination.
2Object-affected harmful factors
If ions are blocked from entering the processing space, then discharge and damage to substrate and chamber components are prevented, but the passage of activated processing gas through through-holes may be obstructed
Solution Approach 1:
The ion shielding member is designed with localized ion shielding surfaces positioned specifically to intercept incoming ions at angles that maximize blocking efficiency. The structure provides different functional qualities in different regions: dense shielding where ions are incident, and open passages where gas flow is required. This local differentiation allows simultaneous achievement of ion blocking and gas flow efficiency.
Solution Approach 2:
The ion shielding surface is oriented at specific angles relative to the through-holes, creating a three-dimensional arrangement where ions are blocked by the shielding surface while gas flows through the holes. By utilizing angular orientation and spatial positioning, the design separates the functions of ion blocking and gas transmission in different spatial dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents discharge in the processing space, protecting the substrate and chamber components by blocking ion entry while allowing reactive gas radicals to reach the substrate efficiently.
Implementation Method 1
a plasma generation space constituting a plasma generation mechanism configured to convert the processing gas into plasma
Implementation Method 2
an ion shielding member provided in the plurality of through-holes, having an ion shielding surface disposed to intersect a direction in which ions contained in the processing gas converted into plasma are incident toward the through-holes, and configured to allow the activated processing gas to pass through the through-holes where the incidence of ions is blocked by the ion shielding surface
Data Source
AI summary
A plasma processing apparatus comprises: a placing table in a processing chamber for placing a substrate; a plasma generation space constituting a plasma generation mechanism to convert a processing gas into plasma; a processing gas supply part for supplying the gas to the plasma generation space; a perforated plate at a position where the processing gas converted into plasma flows out, the plate having through-holes for passing activated processing gas; and an ion shielding member provided in the through-holes, having an ion shielding surface intersecting a direction of incidence of ions contained in the processing gas converted into plasma, and configured to allow the activated gas to pass through the through-hole while blocking ion incidence via the ion shielding surface.


