Point-of-Use Remote Plasma Source for Radical Delivery and RF Isolation
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Solution Overview
Problem
Current plasma processing technologies face challenges in efficiently generating and delivering radicals to substrates due to recombination losses and interference from external RF sources, particularly in remote plasma systems used for substrate treatment.
Innovation Solution
A point-of-use remote plasma source is designed with a specific configuration of conductors, dielectric layers, and gas flow management to create a resonant electromagnetic field within an enclosure, generating radicals efficiently and minimizing recombination by positioning the gas outlet close to the processing volume and using a gas distribution plate to control ion flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a remote plasma source is used to generate radicals for substrate processing, then radical generation capability is improved, but recombination losses increase due to distance from processing chamber
Solution Approach 1:
The plasma source is divided into multiple independent plasma generation zones along the gas flow path, allowing radicals to be generated continuously at multiple points rather than relying on transport from a single distant source, thereby reducing recombination losses
Solution Approach 2:
A resonant cavity structure with specific conductor and dielectric configurations is introduced as an intermediary to enhance RF energy coupling efficiency, enabling more effective radical generation with reduced energy losses
2Productivity
If external RF sources are used for plasma processing, then processing capability is improved, but interference from external RF sources increases affecting plasma stability
Solution Approach 1:
The harmful external RF interference is extracted and isolated from the plasma generation region by using a resonant cavity structure that confines RF energy within specific boundaries, allowing productive RF coupling while excluding harmful external signals
Solution Approach 2:
The resonant cavity structure converts potential RF interference into beneficial confined RF energy by tuning the cavity to resonate at the desired processing frequency, transforming external RF noise into controlled plasma-generating energy
3Adaptability or versatility
If gas outlet is positioned far from processing volume, then plasma source design flexibility is improved, but radical delivery efficiency decreases
Solution Approach 1:
The gas outlet positioning is made dynamic and configurable rather than fixed, allowing optimization of the distance between gas outlet and processing volume based on specific process requirements, thereby maintaining design flexibility while enabling efficient radical delivery
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances radical generation and delivery to the substrate, reducing recombination losses and preventing interference from external RF sources, thereby improving the effectiveness of plasma processing.
Implementation Method 1
the first conductor, dielectric layer, and second conductor at least partially form a capacitor having a resonance proximate the frequency to form an electromagnetic field within the enclosure suitable to form radicals from the gas
Implementation Method 2
having a resonance proximate the frequency to form an electromagnetic field within the enclosure suitable to form radicals from the gas
Implementation Method 3
form an electromagnetic field within the enclosure suitable to form radicals from the gas
Implementation Method 4
form radicals from the gas
Implementation Method 5
the gas outlet includes a gas distribution plate comprising a plurality of holes disposed therethrough
Data Source
AI summary
Methods and apparatus for a point of use remote plasma source are provided. In embodiments, a remote plasma apparatus includes: an enclosure surrounding a cavity; a first conductor surrounding a first portion of the enclosure; a second conductor surrounding a second portion of the enclosure, wherein the first portion of the enclosure and the second portion of the enclosure overlap by an overlap amount, and wherein each of the first conductor and the second conductor are circumferentially discontinuous; a dielectric layer disposed between and separating the first conductor and the second conductor; a gas inlet configured to flow a gas into the cavity; and a gas outlet disposed in a bottom of the enclosure and configured to flow the gas out of the cavity.


