Removable Airflow Guide Assembly for Processor and Memory Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Computing devices face challenges with heat dissipation, as existing cooling units can obstruct access to internal components, inadequately reduce temperature, and create noise and space constraints, making servicing and upgrading difficult.
Innovation Solution
A removable airflow guide assembly with a processor air cooler and memory bank coolers that can be easily detached, featuring a connector socket for power delivery and angled positioning to enhance airflow efficiency, preventing preheated air from mixing and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling units are installed to dissipate heat from internal components, then cooling efficiency is improved, but access to internal components for servicing and upgrading becomes difficult
Solution Approach 1:
The cooling system is divided into modular cooling units that can be independently installed and removed. Each cooling unit corresponds to specific heat-generating components, allowing selective access to internal components by removing only the necessary cooling unit rather than the entire cooling system.
Solution Approach 2:
The cooling units are designed to be dynamically removable and reconfigurable. The system transitions from a fixed cooling arrangement to a flexible one where cooling units can be moved, added, or removed based on servicing needs or thermal requirements, enabling both efficient cooling and easy access to internal components.
2Temperature
If cooling units are positioned directly over components for effective cooling, then heat dissipation is improved, but the design becomes bulky and space-constrained
Solution Approach 1:
Different cooling units are designed with different structures and cooling capacities matched to the specific thermal characteristics of the components they serve. High-heat components receive more aggressive cooling solutions while lower-heat components use compact cooling units, optimizing cooling efficiency while minimizing overall system volume.
Solution Approach 2:
Cooling units are positioned at various angles and orientations rather than directly overhead. Some cooling units are angled relative to the circuit board to direct airflow efficiently while occupying less vertical space, reducing the bulky appearance and freeing up chassis space.
3Temperature
If airflow is directed directly over components for cooling, then cooling effectiveness is improved, but preheated air recirculation increases overall device temperature
Solution Approach 1:
The exhaust airflow is extracted and directed away from the component cooling zones through dedicated exhaust paths. This separates the cooling airflow from the exhaust airflow, preventing preheated air from recirculating back over the components and maintaining cooling effectiveness.
Solution Approach 2:
Airflow guide structures and baffles are introduced as intermediary elements to manage air flow paths. These structures direct cool air to components while routing exhaust air away, preventing the mixing of hot and cold air streams and eliminating recirculation of preheated air.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easier access and servicing of internal components while providing efficient cooling by ensuring fresh air reaches critical components, reducing noise, and allowing for a more compact design.
Implementation Method 1
The processor air cooler, which is not directly aligned over the processor, directs cool air over the processor
Implementation Method 2
The memory bank coolers direct cool air over the memory banks
Data Source
AI summary
Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.