Removable Alignment Tool for Semiconductor Socket Versatility

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Solution Overview

Problem

Standard semiconductor sockets are often inflexible and require modification to accommodate various geometrically different semiconductor components, limiting their versatility and necessitating the stocking of multiple modified sockets for different components.

Innovation Solution

The use of removable mechanical or optical alignment tools allows for the alignment and retention of semiconductor components within standard sockets, enabling the use of generic socket configurations with multiple semiconductor configurations without permanent modification, utilizing a controller, manipulator, and alignment tools to ensure precise alignment and retention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If standard sockets are used without modification, then socket simplicity and ease of manufacture are maintained, but the ability to accommodate various geometrically different semiconductor components is limited

Engineering Contradiction:

Improveability to accommodate various semiconductor componentsVSAvoidsocket modification complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The alignment tool is divided into separate components including a body portion, alignment features, and retention features that can function independently or in combination. This segmentation allows the alignment tool to accommodate various semiconductor component geometries while keeping the socket design simple and modular.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The alignment tool serves as an intermediary component between the standard socket and the semiconductor component. It provides the necessary alignment and retention functions without requiring modification to the socket itself, thus resolving the contradiction between versatility and complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If multiple modified sockets are stocked for different components, then component-specific alignment precision is improved, but inventory complexity and cost increase

Engineering Contradiction:

Improvecomponent alignment precisionVSAvoidnumber of different socket types to stock

Core Design Contradiction:

Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The alignment tool is designed with universal applicability to work with multiple semiconductor component types within a single socket. The alignment features can accommodate different component geometries, eliminating the need to stock multiple specialized sockets while maintaining alignment precision.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The alignment tool incorporates movable or adjustable features that can adapt to different semiconductor component configurations. This dynamic capability allows a single socket with one alignment tool to replace multiple static sockets designed for specific component types.

Inventive Principle:

Principle #15Dynamics

3Ease of operation

If removable alignment tools are used, then socket versatility and ease of operation are improved, but device complexity and potential misalignment risks increase

Engineering Contradiction:

Improvecomponent loading and alignment easeVSAvoidalignment accuracy and retention reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The alignment features are pre-configured on the alignment tool body to automatically guide the semiconductor component into the correct position during insertion. This preliminary alignment action ensures accurate positioning before the retention features engage, maintaining reliability while improving ease of operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The alignment tool is designed to self-align with the semiconductor component through geometric constraints and mating features. This self-alignment mechanism reduces the risk of misalignment while maintaining the benefits of removable tools, as the system automatically corrects positioning errors during insertion.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS8074353B2Methods of providing semiconductor components within sockets

Publication Date: 2011.12.13 MICRON TECHNOLOGY INC

AI summary

The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.