Removable Dual-Interface Chip Assembly With Booster Antenna
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Solution Overview
Problem
Current smart card and wearable devices with contactless interfaces operate as separate units, lacking a versatile chip arrangement that can seamlessly transition between contact-based and contactless modes without damage, limiting their form factor versatility and communication range.
Innovation Solution
A chip arrangement featuring a chip module with both contact-based and contactless interfaces, housed in a carrier with a booster antenna, allowing for repeated insertion and removal without damage, enabling dual interface functionality in smart cards and wearables while meeting standard range specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the chip module is designed for repeated insertion and removal, then the versatility and reusability are improved, but the mechanical connection complexity increases
Solution Approach 1:
The mechanical connection is designed as a dynamic press-fit system where the chip module can be repeatedly inserted and removed through controlled elastic deformation of the carrier body. The pressing element applies variable force to secure the chip module during use, while allowing easy removal when needed, enabling multiple insertion/removal cycles without destruction.
Solution Approach 2:
The system is divided into separable components: the chip module and the carrier with chip module receptacle. This segmentation allows the chip module to be independently removed and reinserted, providing versatility for different use cases (smart card mode vs. wearable mode) while maintaining a relatively simple connection interface.
2Length of stationary object
If a booster antenna is integrated in the carrier, then the communication range is extended, but the device complexity increases
Solution Approach 1:
The booster antenna is integrated directly into the carrier body, merging the antenna function with the structural component. This combination extends the communication range for contactless operations while avoiding the need for separate antenna assemblies, thereby limiting the increase in overall device complexity.
3Adaptability or versatility
If the chip module is made removable, then the form factor versatility is improved, but the reliability of connection decreases
Solution Approach 1:
The pressing element provides dynamic securing force that maintains reliable connection during normal operation, while allowing controlled removal when needed. This dynamic mechanism ensures connection stability for smart card operations but enables easy removal for wearable applications.
Solution Approach 2:
The mechanical connection design includes features that prevent damage during repeated insertion and removal cycles, such as elastic deformation zones in the carrier body and protective structures around the chip module receptacle, ensuring long-term reliability despite the removable nature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables multiple insertion and removal cycles of the chip module, extending communication range and allowing for versatile use in both smart cards and wearables, meeting standard range requirements.
Implementation Method 1
a booster antenna structure (114), which, when the chip module (102) is arranged in the chip module receptacle (112) of the carrier (110), inductively couples to the antenna structure (108) of the chip module (102)
Data Source
AI summary
A chip arrangement including a chip module which includes a chip, a contact-based interface in accordance with ISO 7816 which is electrically conductively connected to the chip, and an antenna structure which is electrically conductively connected to the chip and provides a contactless interface, and a carrier which comprises a chip module receptacle and a booster antenna structure which, when the chip module is arranged in the chip module receptacle of the carrier, inductively couples to the antenna structure of the chip module, wherein the chip module is arranged releasably in the chip module receptacle.