Removable Heat Transfer Device for Interchangeable Expansion Module Cooling
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Solution Overview
Problem
Existing heat sink solutions for interchangeable computer modules are either insufficient for cooling or compromise compactness and maintainability, particularly when permanently mounted with liquid cooling systems, and do not allow for easy return to the manufacturer for warranty purposes.
Innovation Solution
A heat sink with a removable heat transfer device that can be placed against the heat exchange surface of the module and is in thermal contact with the computer card's cooling module, eliminating the need for a liquid cooling system and allowing for easy detachment and reconfiguration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid heat sinks with inlet and outlet pipes are permanently mounted on interchangeable extension modules, then cooling efficiency is improved, but device size increases and compactness is compromised
Solution Approach 1:
The heat sink is divided into two separate parts: a cooling module permanently mounted on the computer card, and a heat transfer device that attaches to the extension module. This segmentation eliminates the need for inlet/outlet pipes on the module while maintaining liquid cooling efficiency through the thermal contact between the two separated components.
Solution Approach 2:
The heat transfer device acts as an intermediary component that bridges the extension module and the cooling module. It captures heat from the module's exchange surface and transfers it to the cooling module, enabling efficient heat removal without requiring permanent liquid cooling infrastructure on the module itself.
2Temperature
If liquid heat sinks with inlet and outlet pipes are permanently mounted on interchangeable extension modules, then cooling efficiency is improved, but maintainability deteriorates due to inability to return modules to manufacturer
Solution Approach 1:
By separating the heat sink into a permanent cooling module and a removable heat transfer device, the extension module can be detached and returned to the manufacturer without the cooling infrastructure, preserving warranty eligibility while maintaining operational cooling capability when installed.
Solution Approach 2:
The heat transfer device transitions from a static permanent mounting to a dynamic removable attachment, allowing the system to adapt between operational state (attached for cooling) and maintenance state (removed for module return), thereby improving maintainability.
3Volume of moving object
If air heat sinks are used on interchangeable extension modules, then device compactness is maintained, but cooling sufficiency deteriorates
Solution Approach 1:
The invention transitions from air cooling to liquid cooling by implementing a cooling module with coolant circulation. The heat transfer device captures heat and transfers it to the liquid cooling system, providing superior cooling sufficiency while maintaining the compact form factor through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective cooling while maintaining compactness and facilitating easy maintenance and warranty returns by using a removable heat transfer device that efficiently captures and transfers heat without the bulk of liquid cooling systems.
Implementation Method 1
it is in thermal contact with said cooling module of said card
Implementation Method 2
the heat captured by the heat transfer device can be transferred to the computer board cooling module via this heat transfer device
Implementation Method 3
at least one cooling module in which a cooling fluid travels
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a heat sink for an interchangeable expansion module that can be connected to a computer board, said heat sink having at least one cooling module in which a coolant flows, and at least one first electrical connector, wherein said expansion module (4) has at least one second electrical connector configured to be connected to said first electrical connector of said board, and has at least one heat-exchange surface (18, 19), said heat sink (20) comprising at least one heat-transfer device (21) configured to be removably placed against said exchange surface (18, 19), and said device (21) further being configured such that it is in thermal contact with said cooling module and is mechanically attached, in a removable manner, to said cooling module of said board when said extension module (4) is connected to said board.