Removable Low-Power Memory Module With Compact Connector Footprint
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Solution Overview
Problem
High lead count and low power memory components, such as BGA packages and LP DDR5, are typically soldered directly on the main board, offering limited flexibility for upgrades and scalability.
Innovation Solution
A removable memory module design using board-to-board connectors that maintain a similar footprint to traditional soldered components, allowing for easier upgrades and scalability, with signal pads and pin pads positioned for close proximity and short routing lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory components are soldered directly on the main board, then manufacturing reliability is improved, but adaptability and ease of upgrade are worsened
Solution Approach 1:
The memory system is segmented into a removable memory module that can be separated from the main board. The memory component is mounted on a circuit board with connectors, allowing it to be detached and replaced without affecting the main board structure. This segmentation enables upgrades while maintaining reliable connections during operation.
Solution Approach 2:
The connection between the memory component and main board is made dynamic through removable connectors. The memory module can transition between connected and disconnected states, allowing the system to adapt to different configurations and upgrades while maintaining stable connections during active use.
2Adaptability or versatility
If a removable memory module design is used, then adaptability and ease of upgrade are improved, but device complexity is worsened
Solution Approach 1:
The memory component and circuit board are merged into a single removable memory module assembly. This integration reduces the number of separate components and simplifies the overall structure, making the removable design more compact and easier to implement without significantly increasing device complexity.
Solution Approach 2:
The circuit board serving as the memory module carrier is designed with universal connectors that can interface with standard main board sockets. This multi-functional design allows the same memory module structure to be used across different device configurations, reducing overall system complexity through standardization.
3Reliability
If board-to-board connectors are used with short routing lengths, then signal integrity is improved, but manufacturing precision requirements are worsened
Solution Approach 1:
The routing length parameter is optimized to be short, which improves signal integrity by reducing transmission distance and interference. The connector positioning and trace routing are designed with specific parameter values that balance signal quality requirements with manufacturable tolerances.
Solution Approach 2:
The circuit board is designed with localized signal routing that provides optimal trace paths from the memory component to the connectors. Critical signal paths have enhanced local quality with controlled impedance and minimized interference, while non-critical areas have relaxed requirements, allowing manufacturing within standard precision tolerances.
Data Source
AI summary
An embodiment of an electronic apparatus comprises a circuit board, one or more memory devices affixed to a top side of the circuit board, and one or more board-to-board connectors affixed to a bottom side of the circuit board to provide an external connection to signals of the one or more memory devices, where the one or more board-to-board connectors are located inward from outermost edges of the circuit board and where a first footprint defined by an outermost boundary of the one or more board-to-board connectors is substantially a same size as or smaller than a second footprint defined by an outermost boundary of the one or more memory devices. Other embodiments are disclosed and claimed.