Removable Probe Clamp for Non-Destructive PCB Signal Measurement
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Solution Overview
Problem
Existing high-speed signal measurement systems require advanced soldering skills, are difficult to attach and detach, and risk damaging printed circuit boards (PCBs) due to heat exposure, and often introduce signal interference issues, making them unsuitable for production PCBs and mid bus probing.
Innovation Solution
A high-speed signal measurement system with a removable housing and spring mechanism that establishes electrical contact between conductive probe tips and PCB pads without soldering, allowing for easy attachment and detachment, minimizing signal interference, and enabling measurements on production PCBs and mid bus probing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering methods are used to attach probe tips to PCBs, then electrical connection is established, but the process requires advanced soldering skills and risks damaging the PCB due to heat exposure
Solution Approach 1:
The patent replaces the thermal field-based soldering process with a mechanical field-based clamp system. The clamp mechanism physically secures the probe tip to the PCB through mechanical force, eliminating the need for soldering skills and heat exposure, thus resolving the contradiction between connection reliability and ease of attachment
Solution Approach 2:
The clamp acts as an intermediary component between the probe tip and the PCB. Instead of directly soldering the probe tip to the PCB, the clamp provides a removable mechanical interface that establishes electrical connection without requiring advanced soldering skills or causing heat damage to the PCB
2Reliability
If traditional soldering methods are used, then electrical connection is established, but the process is difficult to attach and detach
Solution Approach 1:
The clamp mechanism provides a dynamic attachment system that can be quickly opened and closed to secure or release the probe tip. This dynamic mechanical system allows for rapid attachment and detachment compared to the permanent or time-consuming soldering process, resolving the contradiction between connection reliability and time loss
3Measurement precision
If traditional measurement devices are used, then high-speed signal measurements can be performed, but signal interference issues are introduced
Solution Approach 1:
The patent extracts the source of signal interference by using a removable clamp system that does not require permanent soldering connections. This eliminates the harmful thermal and electrical interference associated with soldering processes, allowing for accurate high-speed signal measurements while removing the interfering factors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for efficient, non-destructive high-speed signal measurements on PCBs without requiring advanced soldering skills, reducing the risk of damage and signal interference, and is suitable for both production and test vehicles.
Implementation Method 1
a spring mechanism configured to exert a spring force to maintain the electrical connection between the conductive probe tip and the conductive pad
Data Source
AI summary
A high-speed signal measurement system includes a printed circuit board and a measurement device. The printed circuit board includes a conductive pad. The measurement device is configured to be removably coupled to the printed circuit board. The measurement device is configured to establish an electrical connection between a conductive probe tip and the conductive pad. The measurement device includes a clamp movable between an open position in which the measurement device is configured to removably receive the conductive probe tip and a closed position in which the measurement device is configured to retain the conductive probe tip. The measurement device further includes a spring mechanism configured to exert a spring force to maintain the electrical connection between the conductive probe tip and the conductive pad when the measurement device is coupled to the printed circuit board and the clamp is in the closed position.