Removable Probe Pads for Flat Hybrid Bonding Surfaces
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Solution Overview
Problem
The formation of probe marks on semiconductor chip probe pads during testing impairs the flatness of the bonding surface, which is essential for hybrid bonding, leading to challenges in achieving the required flatness for effective hybrid bonding.
Innovation Solution
A method is described where the probe pad is removed after testing, and the pad electrode and interlayer insulating film are formed to be substantially coplanar, ensuring high flatness and minimizing exposure to the atmosphere, thus reducing corrosion and allowing for hybrid bonding without additional test processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If probe pads are used for testing semiconductor chips, then testing can be performed, but probe marks are formed on the probe pads which impair the flatness of the bonding surface
Solution Approach 1:
The bonding surface is divided into two distinct regions: a probe pad region for testing and a bonding region for hybrid bonding. This segmentation allows the probe pad to be located at a specific position where it will not interfere with the bonding surface flatness, enabling both testing and high-precision bonding to coexist.
Solution Approach 2:
Different regions of the bonding surface are given different functions and properties. The probe pad region is designed to accept probing operations, while the bonding region maintains high flatness for hybrid bonding. This local differentiation allows each region to optimize its specific function without compromising the other.
2Ease of manufacture
If the bonding surface is made flat for hybrid bonding, then hybrid bonding can be enabled, but probe marks formed during testing impair this flatness
Solution Approach 1:
The bonding surface is segmented into a probe pad region and a bonding region, allowing the bonding region to maintain the required flatness for hybrid bonding while the probe pad region accommodates testing operations without compromising overall bonding surface quality.
Solution Approach 2:
The probe pad is positioned and configured in advance during the manufacturing process, before hybrid bonding occurs. This preliminary arrangement ensures that the probe pad will not interfere with the bonding surface flatness when hybrid bonding is performed later.
3Manufacturing precision
If probe pads are removed after testing, then bonding surface flatness is improved, but additional process steps are required
Solution Approach 1:
The probe pad is positioned and configured in advance during the manufacturing process, before hybrid bonding occurs. This preliminary arrangement ensures that the probe pad will not interfere with the bonding surface flatness when hybrid bonding is performed later, eliminating the need for post-testing removal steps.
Solution Approach 2:
The probe pad is designed with specific local properties and positioning that allow it to be selectively removed only from the bonding region after testing, while preserving the bonding surface flatness. This localized approach minimizes the impact on the overall manufacturing process.
Data Source
AI summary
Disclosed herein is a method that includes forming a contact plug to be embedded in a first insulating film formed on a semiconductor substrate; forming a probe pad on the first insulating film to contact with the contact plug; performing a test operation by probing the probe pad; removing the probe pad; forming a second insulating film to cover the contact plug after removing the probe pad; and forming a pad electrode to be embedded in the second insulating film.