Removable Support Substrate for Thin Wiring Substrates
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Solution Overview
Problem
The challenge is to create a semiconductor device with a thinner wiring substrate that maintains mechanical strength and handling convenience, as existing technologies face difficulties in reducing substrate thickness due to decreased mechanical strength and increased risk of defective solder ball bonding with narrower wire pitches.
Innovation Solution
A wiring substrate design featuring a removable support substrate adhered to an adhesive layer, where the support substrate is removed after encapsulating resin formation, allowing for reduced thickness while maintaining mechanical strength and improving electric connection reliability without the need for plug plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the tape substrate is decreased to make the semiconductor device thinner, then the overall device thickness is reduced, but the mechanical strength of the tape substrate deteriorates
Solution Approach 1:
The invention applies preliminary action by forming the encapsulating resin before removing the tape substrate. The encapsulating resin is formed to cover the wiring substrate and semiconductor element, providing mechanical strength support during the substrate removal process. This preliminary formation of the resin structure allows the tape substrate to be removed safely without compromising the mechanical integrity of the overall device.
Solution Approach 2:
The invention extracts the tape substrate from the final device structure. The tape substrate is removed after the encapsulating resin has been formed, leaving only the necessary components (wiring substrate, semiconductor element, and encapsulating resin). This extraction eliminates the need for the tape substrate in the final product, achieving thickness reduction while maintaining mechanical strength through the encapsulating resin.
2Adaptability or versatility
If the wire pitch is narrowed to increase mounting density, then the capacity and number of pins are increased, but the reliability of solder ball bonding deteriorates
Solution Approach 1:
The invention introduces an intermediary structure - the encapsulating resin - that fills the space between the wiring substrate and the solder balls. This resin mediator provides mechanical support and stabilizes the solder balls during the bonding process, even when wire pitches are narrowed. The encapsulating resin acts as a buffer that maintains bonding reliability despite reduced spacing between connection elements.
3Reliability
If plug plating is performed to ensure reliable electric connection through through holes, then electric connection reliability is improved, but manufacturing complexity and processing time are increased
Solution Approach 1:
The invention extracts the plug plating process from the manufacturing sequence. Instead of performing plug plating to ensure electric connection reliability, the invention removes this complex step entirely. The encapsulating resin provides the necessary mechanical support and environmental protection, making the additional plug plating step unnecessary. This simplifies the manufacturing process while maintaining connection reliability through alternative means.
Solution Approach 2:
The invention employs a simpler, more economical approach by using the encapsulating resin as a temporary protective structure during manufacturing. The resin provides necessary support and protection during assembly and bonding processes, then remains as part of the final device structure. This replaces the more complex and costly plug plating process with a simpler resin-based solution that achieves the same reliability goals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a thinner semiconductor device with enhanced mechanical strength and improved electric connection reliability, reducing manufacturing costs and processing time by eliminating the need for plug plating and maintaining handling convenience.
Implementation Method 1
The support substrate is adhered to the adhesive layer in a removable manner
Data Source
AI summary
A wiring substrate includes an adhesive layer, a wiring layer, and a support substrate. The adhesive layer includes a first surface and a second surface that is opposite to the first surface. The wiring layer is formed on the first surface of the adhesive layer. The support substrate is formed on the second surface of the adhesive layer. The wiring layer is partially exposed in a through hole extending through the adhesive layer and the support substrate in a thicknesswise direction. The support substrate is adhered to the adhesive layer in a removable manner.