Removable Thermal Connector for Sealed Electronics Cooling
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Solution Overview
Problem
Existing heat management strategies for computing devices, such as data centers and edge AI devices, are bulky and inflexible, leading to increased device size, reduced sealing, and potential damage from dust and water ingress.
Innovation Solution
A thermal connector with a main body featuring a support portion and a heat transfer element, designed for removable coupling with the device housing, allowing efficient heat transfer to a cooling module outside the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks and cooling fans are used to cool the chipset, then heat dissipation is improved, but device size increases and sealing is compromised
Solution Approach 1:
The invention extracts the cooling function from the device housing by providing a removable cooling assembly that can be detached from the housing. This allows the housing to be completely sealed while the cooling assembly provides heat dissipation when attached, resolving the contradiction between heat dissipation performance and device sealing/size.
Solution Approach 2:
The cooling system is segmented into a separate removable assembly rather than being integrated into the housing. This segmentation allows the housing to maintain complete sealing for dust and water protection while the separate cooling assembly provides thermal management when coupled to the device.
2Temperature
If ventilation holes and gaps are created for cooling, then heat dissipation is improved, but dust and water particles can enter the housing
Solution Approach 1:
The invention removes the need for ventilation holes in the housing by extracting the cooling function to a separate removable assembly. The housing can be completely sealed against dust and water, while the cooling assembly provides thermal management through its own design that does not compromise housing sealing.
3Stability of the object's composition
If permanent coupling with screws is used to attach the thermal body, then heat transfer stability is improved, but structural flexibility and component replaceability are reduced
Solution Approach 1:
The invention applies dynamic coupling mechanisms (such as snap-fit, magnetic, or bayonet connectors) that provide stable heat transfer when coupled but allow easy detachment and replacement. This resolves the contradiction between stable heat transfer and component replaceability by enabling the coupling state to transition between firmly attached and easily removable.
Solution Approach 2:
The cooling assembly is segmented as a separate removable component with a standardized coupling interface. This segmentation enables easy replacement of the cooling assembly without affecting the housing or other components, while maintaining stable thermal contact when attached through the coupling interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal connector enables effective heat dissipation outside the device housing, maintaining the housing as dust-free and waterproof, while allowing for easy installation and replacement of cooling components.
Implementation Method 1
a heat transfer element (6) in contact with the support portion (5)
Data Source
AI summary
Thermal connector (1) for conducting heat from a device generating heat (2) located in a housing (8) to a cooling module (3), the thermal connector (1) comprising a main body (4) including a support portion (5) and a heat transfer element (6) in contact with the support portion (5), wherein the main body (4) comprises a coupling interface (17) for being coupled in a removable way with the housing (8) of the device (2).