Electronic Unit Repair Group Transfer Using Integrated Defect Maps
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Solution Overview
Problem
The preparation of transfer heads based on transfer defective rates increases management difficulty and cost due to the need for a larger number of heads in current mass transfer technology for electronic units.
Innovation Solution
A method involving defect map integration and grouping of electronic units on a substrate, where repairing groups with consistent defect distributions are transferred using fewer transfer heads, reducing the overall number required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of transfer heads is increased to account for transfer defective rates and transfer head defective rates, then the reliability of the transfer process is improved, but the device complexity and management difficulty increase
Solution Approach 1:
The patent applies preliminary action by pre-classifying electronic units into different defect types and preparing corresponding repair groups in advance. Defect maps are generated beforehand to identify specific defective locations, and repair groups are pre-configured with appropriate transfer heads matched to specific defect types. This allows the system to handle defects as they occur without maintaining excessive spare transfer heads, thereby improving reliability while reducing management complexity.
2Reliability
If the number of transfer heads is increased to account for transfer defective rates and transfer head defective rates, then the reliability of the transfer process is improved, but the cost increases
Solution Approach 1:
The patent applies local quality by matching specific transfer heads to specific defect types rather than using a uniform approach. Different transfer heads are optimized for different defect characteristics (e.g., missing electronic units, misplaced units, damaged units). This specialization allows the system to achieve high reliability with fewer total transfer heads, as each head is efficiently utilized for its specific function rather than being a general-purpose backup.
Solution Approach 2:
The patent changes the parameter of transfer head selection dynamically based on defect type. Instead of using a fixed number of transfer heads determined by statistical defective rates, the system adjusts the number and type of transfer heads used based on the actual defect maps generated during inspection. This allows the system to adapt the resource allocation to actual needs, reducing the total number of transfer heads required while maintaining reliability.
3Measurement precision
If defect maps are integrated into multiple second defect maps, then the precision of defect localization is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the defect map integration process into manageable segments. Instead of integrating all defect information into a single complex map, the system divides defects into different categories (e.g., missing units, misplaced units, damaged units) and creates separate defect maps for each category. Each segmented map can be processed independently with simpler algorithms, and the results are then combined to guide the repair process. This segmentation maintains high localization precision while reducing the complexity of the integration process.
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following. A substrate is provided. A plurality of electronic units are transferred to the substrate. The electronic units are inspected to obtain M first defect maps. The M first defect maps are integrated into N second defect maps, where N<M. M repairing groups are provided according to the N second defect maps. Each of the repairing groups includes at least one repairing electronic unit. The M repairing groups are transferred to the substrate. At least two of the repairing groups have the same location distribution of repairing electronic units, and the location distribution is consistent with a defect distribution of one of the second defect maps.