Substrate Electrode Layout for Repairable Module Bonding
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Solution Overview
Problem
The use of Anisotropic Conductive Paste (ACP) and Anisotropic Conductive Film (ACF) in bonding electronic modules to substrates makes it difficult to remove defective devices, increasing repair time and reducing process yield and product price.
Innovation Solution
Incorporating spare electrodes and a bonding material with a low laser absorption rate, allowing for simplified repair through laser irradiation by curing the bonding material on initial electrodes while leaving spare electrodes uncured, enabling easy replacement of defective module structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ACP or ACF is used to bond electronic modules to substrates, then bonding strength is improved, but repairability deteriorates because the polymers harden and become difficult to remove
Solution Approach 1:
The bonding material is segmented into different regions: cured bonding material in the first region (initial electrodes) providing strong bonding, and uncured bonding material in the second region (spare electrodes) enabling easy repair. This spatial segmentation allows simultaneous achievement of strong bonding and repairability.
Solution Approach 2:
Different regions of the bonding material have different curing states: the first region has cured bonding material for strong adhesion, while the second region has uncured bonding material for easy removal and replacement. This local quality differentiation resolves the contradiction between bonding strength and repairability.
2Reliability
If ACP or ACF is used for bonding, then bonding reliability is improved, but repair time increases due to difficulty in removing defective devices
Solution Approach 1:
The substrate is divided into a first region with cured bonding material for reliable bonding and a second region with uncured bonding material for quick repair operations, reducing repair time while maintaining bonding reliability where needed.
Solution Approach 2:
The bonding material is pre-applied in an uncured state to the spare electrodes, preparing the substrate in advance for potential repair operations. This preliminary preparation eliminates the need for complex removal processes when defects occur, reducing repair time.
3Manufacturing precision
If uniform curing of bonding material is applied to all electrodes, then bonding consistency is improved, but repair process complexity increases
Solution Approach 1:
The bonding material exhibits local quality differences in its curing state: fully cured in the first region for consistent bonding, and partially uncured in the second region for simplified repair. This local differentiation maintains bonding consistency where required while simplifying the repair process.
Solution Approach 2:
Instead of fully curing the bonding material on all electrodes, only partial curing is applied selectively to the first region, leaving the second region partially uncured. This partial action approach maintains bonding consistency for functional electrodes while reducing repair process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces repair time and cost by allowing for efficient replacement of defective modules without additional treatment steps, thereby increasing production yield.
Implementation Method 1
curing the bonding material on the corresponding spare electrodes by irradiating a laser to the new module structures
Data Source
AI summary
Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.