Repairable RDL Layout With Custom Rerouting Around Defects
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Solution Overview
Problem
Existing semiconductor devices face manufacturing defects in redistribution layers (RDLs) such as shorts and opens, which affect their functionality and reliability, and current methods do not effectively address these issues during production.
Innovation Solution
A method is introduced to form a repairable RDL design by inspecting for defects and forming custom RDL segments to reroute around defects, using redundant traces to mitigate issues like shorts and opens, ensuring the new design meets electrical constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional RDL design is used without repair capability, then manufacturing process is simpler, but device reliability deteriorates due to manufacturing defects such as shorts and opens
Solution Approach 1:
The RDL is divided into multiple conductive segments (first conductive segments and second conductive segments) that can be independently formed and inspected. This segmentation allows defects to be isolated and repaired by forming alternative segments without requiring complete redesign of the entire RDL structure.
Solution Approach 2:
Redundant conductive segments are pre-planned and prepared in the RDL design before manufacturing defects occur. When defects are detected during inspection, these pre-prepared redundant segments can be activated to bypass the defective areas, eliminating the need for complete RDL redesign and enabling real-time repair.
2Productivity
If RDL defects are detected and repaired using custom design, then device yield improves, but manufacturing time increases
Solution Approach 1:
The redundant conductive segments are pre-configured in the design stage with appropriate geometries and positions. When defects are detected, the repair process only requires forming additional conductive segments along predetermined paths rather than performing complete RDL redesign, significantly reducing repair time.
Solution Approach 2:
The system performs self-diagnosis through automated optical inspection (AOI) and self-repair by forming custom conductive segments based on detected defects. This automated approach eliminates manual intervention and reduces the time required for defect identification and repair implementation.
3Reliability
If redundant conductive segments are formed to repair defects, then RDL reliability improves, but manufacturing complexity increases
Solution Approach 1:
The same conductive material deposition and patterning processes used for forming original RDL segments are also used for forming redundant and repair segments. This multi-functionality of the manufacturing process reduces the need for additional specialized equipment and simplifies the overall fabrication workflow.
Solution Approach 2:
The repair approach utilizes the vertical dimension by forming second conductive segments on different layers or planes than the first conductive segments. This allows repair paths to be created in three-dimensional space, providing multiple routing options without increasing lateral complexity on any single layer.
Data Source
AI summary
The disclosure concerns methods of forming a semiconductor device with a repairable redistribution layer (RDL) design, comprising: preparing an original repairable RDL design; forming first conductive segments of the repairable RDL design; inspecting the first conductive segments of the repairable RDL design to detect manufacturing defects; detecting at least one defect in the first conductive segments; and forming second conductive segments of the repairable RDL design according to a new custom RDL design to mitigate the negative effects of the at least one defect among the first conductive segments. The disclosure also concerns semiconductor devices with a repairable RDL design.