Replaceable Fiber Connectors for Photonic Integrated Circuit Packages
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Solution Overview
Problem
The packaging of photonic integrated circuits (PICs) faces challenges in achieving high-density, high-bandwidth electrical communication while maintaining optical access, with fragile fiber pigtails leading to manufacturing complexities and reduced yields due to misalignment or breakage, necessitating innovative solutions for stable optical signal transmission.
Innovation Solution
Incorporating a thin glass core into the package substrate with a dielectric material and conductive pathways, allowing for magnetic coupling between the PIC and fiber connector, enabling high-density interconnects and reducing signal losses, and using magnetic materials for secure attachment of fibers within V-groove channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiber pigtails are used for optical signal transmission, then optical access is enabled, but manufacturing complexity increases and yield decreases due to misalignment or breakage
Solution Approach 1:
The patent replaces the traditional mechanical fiber pigtail system with an integrated optical waveguide structure fabricated directly on the semiconductor chip. This substitution eliminates the need for separate fiber alignment and connection mechanisms, thereby reducing manufacturing complexity while maintaining optical transmission reliability through monolithic integration of the optical path into the chip substrate itself
Solution Approach 2:
The patent merges the fiber connector function directly with the semiconductor chip by integrating optical waveguides and coupling structures into the chip substrate. This consolidation combines previously separate components (fiber pigtail, alignment mechanism, and chip interface) into a single integrated unit, simplifying the overall device structure and reducing manufacturing steps while improving alignment precision and reliability
2Productivity
If high-density interconnects are implemented, then electrical communication bandwidth increases, but optical access becomes more difficult to maintain
Solution Approach 1:
The patent resolves the conflict between high-density electrical interconnects and optical access by transitioning from a planar layout to a three-dimensional vertical architecture. Optical waveguides are routed through vertical channels and layered structures, allowing optical paths to pass through or above dense electrical interconnect layers without interference, thereby enabling both high electrical bandwidth and stable optical access in the same device footprint
Solution Approach 2:
The patent segments the device into distinct functional layers: electrical interconnect layers for high-density data transmission and separate optical waveguide layers for optical signal access. This segmentation allows independent optimization of each subsystem - electrical layers can be densely packed while optical layers maintain larger pitch and alignment tolerances, resolving the contradiction between electrical density and optical accessibility
3Ease of repair
If replaceable fiber connectors are used, then ease of repair improves, but device complexity increases
Solution Approach 1:
The patent extracts the fiber connector as a separate, removable component from the main chip assembly, creating a modular interface that can be independently replaced. The chip contains integrated optical waveguides with coupling structures, while the fiber connector is a separate assembly that interfaces with these waveguides through a standardized connection mechanism, enabling easy replacement of faulty connectors without affecting the chip itself
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency by allowing for easier replacement of defective fiber connectors, reduces signal losses, and increases the plated-through hole density and total thickness variation, thereby improving the stability and efficiency of optical signal transmission.
Implementation Method 1
magnetic coupling between the PIC and fiber connector
Data Source
AI summary
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a photonic integrated circuit (PIC) having a first surface having a channel and a first magnetic material; a fiber connector including a second surface with a second magnetic material; and a fiber physically coupled to the second surface of the fiber connector by an adhesive material; wherein the first surface of the PIC is coupled to the second surface of the fiber connector by the first and second magnetic materials with the fiber positioned in the channel.