Replaceable Probe Board with Rotating Ball Pogo Pin
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Solution Overview
Problem
Current probe heads for testing semiconductor integrated circuits and thin film materials are inefficient in reducing test pad sizes, leading to increased die costs and limited chip design support, with existing technologies failing to effectively miniaturize test chip technology for advanced nodes like 1 nm, 3 nm, and 5 nm nodes.
Innovation Solution
A probe head design featuring a slot for a probe board with dramatically reduced width, pitch, and tip surface area probe chips, utilizing traditional machining or 3D printing, and a spring-loaded pogo pin with a rotating ball for contact, connected to a daughterboard and motherboard for enhanced testing capabilities, along with a camera for monitoring probe tip conditions and automating cleaning and replacement processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional probe head designs are used, then test pad sizes remain large, but die costs increase and fewer chip designs can be supported
Solution Approach 1:
The probe head is divided into modular components including a replaceable probe board, probe chips with individual tips, and a reusable head structure. This segmentation allows the probe tips to be miniaturized while maintaining the overall system functionality, enabling smaller test pad sizes without compromising testing capability
Solution Approach 2:
The probe tip geometry parameters are dramatically changed with reduced width, pitch, and tip surface area. The probe chips are designed with substantially reduced dimensions compared to conventional probes, directly enabling smaller test pad sizes and higher die yields
2Area of moving object
If probe tip size is reduced, then test pad size decreases, but manufacturing precision requirements increase
Solution Approach 1:
The probe board incorporates self-aligning features and registration mechanisms that automatically position the miniaturized probe chips with high precision during assembly. This self-service alignment system compensates for the increased manufacturing precision requirements of smaller probe tips
Solution Approach 2:
Multiple probe tips are integrated onto a single probe chip, and multiple probe chips are mounted on the probe board with unified alignment references. This merging approach distributes precision requirements across multiple standardized components rather than demanding extreme precision from individual ultra-small tips
3Productivity
If probe chips are miniaturized, then more test features per die are enabled, but device complexity increases
Solution Approach 1:
The probe board and head structure are designed as universal platforms that can accommodate different probe chip configurations and tip arrangements. This multi-functionality allows the same basic structure to support various test feature densities and patterns, enabling more test features per die without proportionally increasing overall device complexity
Solution Approach 2:
Multiple probe tips are nested on each probe chip, and multiple probe chips are nested on the probe board in a hierarchical arrangement. This nesting strategy packs more test features into the probe head volume without linearly increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a significant reduction in test pad sizes by up to 25%, improving die yields, device performance, and reliability, while supporting advanced semiconductor nodes by allowing for more test features per die and real-time monitoring and maintenance of probe tips.
Implementation Method 1
the rotating ball is spring-loaded and capable of moving up and down along the shank of the pogo pin
Data Source
AI summary
A probe head comprising of pogo pins and a slot for accepting a probe board is provided. The pogo pin has a spring-loaded rotating ball at its apex which allows for smooth sliding of a probe board into the slot. The probe board houses a probe chip with a single or multiple integrated probes. The probes are used to extract the electrical, mechanical, optical, chemical, and structural properties of thin film materials and semiconductor integrated circuits.