Replaceable Probe Tile with Floating Plate for Semiconductor Wafer Testing
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Solution Overview
Problem
Semiconductor test equipment faces challenges in accessing and testing devices on wafers due to varying die pitches and interference from external electrical noise, requiring flexible probe solutions that can handle low currents and diverse device configurations.
Innovation Solution
A probe apparatus with interchangeable plates, floating plates, and a control mechanism providing multi-dimensional motion freedom, allowing for precise positioning and replacement of probe tiles to accommodate different die pitches and reduce noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If different probe tiles are used for different die pitches, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The probe tile is designed with a universal structure that can be used across multiple base plates with different die pitches. The floating plate mechanism enables the same probe tile to adapt to various configurations, eliminating the need for multiple specialized probe tiles while maintaining measurement precision.
Solution Approach 2:
The probe tile is made dynamically adjustable through the floating plate mechanism, which allows positional adjustments in multiple directions. This dynamic capability enables a single probe tile to accommodate different die pitches and orientations, resolving the contradiction between measurement precision and device complexity.
2Manufacturing precision
If probe tiles are fixed in position, then manufacturing precision is improved, but adaptability worsens
Solution Approach 1:
The floating plate mechanism introduces controlled dynamics to the otherwise fixed probe tile assembly. The probe tile can be precisely positioned and then held stable during measurement, providing both manufacturing precision and adaptability to different configurations.
Solution Approach 2:
The system is segmented into modular components (base plate, floating plate, probe tile) that can be independently manufactured with high precision and then assembled in different configurations. This segmentation allows each component to be optimized for precision while the assembly provides adaptability.
3Adaptability or versatility
If multiple probe tiles are used for different configurations, then adaptability is improved, but loss of time increases
Solution Approach 1:
A single universal probe tile design can be used across multiple base plates and configurations, eliminating the need to physically exchange different probe tiles. This universality maintains adaptability while significantly reducing the time required for reconfiguration.
Solution Approach 2:
The dynamic adjustment capability of the floating plate allows rapid repositioning of the probe tile without requiring physical exchange of components. This reduces reconfiguration time while maintaining adaptability to different die pitches and orientations.
Data Source
AI summary
A probe apparatus is provided with a plurality of probe tiles, an interchangeable plate for receiving the probe tiles, a floating plate being disposed between the respective probe tile and a receiving hole on the interchangeable plate, and a control mechanism providing multi-dimensional freedom of motions to control a position of the probe tile relative to the respective receiving hole of the interchangeable plate. A method of controlling the floating plate is also provided by inserting a pair of joysticks into two respective adjustment holes disposed on the floating plate and moving the pair of joysticks to provide translational motions (X-Y) and rotational (theta) motion of the floating plate, and turning the pair of jack screws clockwise and counter-clockwise to provide a translational motion (Z) and two rotational (pitch and roll) motions of the floating plate.