Replicated Circuit Module Layout With Parent Interconnect Configuration
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Solution Overview
Problem
The development and implementation of integrated circuits are resource-intensive due to the need for unique circuit designs, which require separate design, verification, and compliance with design for test (DFT) requirements, and maintaining identical replicated designs while avoiding unconnected module interfaces poses challenges.
Innovation Solution
Integrated circuits with child circuit modules sharing a common base configuration and a parent circuit module using electrical interconnects, such as physical wires, to selectively configure signal values without logic components at the parent level, enabling replicated design and simplifying the parent level implementation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If unique circuit designs are used for each module, then functionality and performance requirements can be met, but resource consumption (time, cost, labor) increases significantly
Solution Approach 1:
The circuit is divided into replicated child circuit modules that share a common base configuration. Each child module is segmented into standardized components (logic component, auxiliary circuit components, signal driver component) that can be independently configured through interconnect selection, allowing functionality differentiation without redesigning entire modules.
Solution Approach 2:
A single base configuration design serves multiple functions across different child circuit modules. The parent circuit module provides universal interconnect structures that can be selectively activated to provide different functionality configurations, eliminating the need for separate unique designs for each module while maintaining adaptability.
2Productivity
If replicated circuit designs are used across modules, then resource consumption is reduced, but maintaining identical designs and avoiding unconnected interfaces becomes challenging
Solution Approach 1:
The interconnect structures are designed to be dynamically configurable rather than statically fixed. The parent circuit module contains interconnects that can be selectively activated or deactivated based on the specific child module configuration requirements, allowing the system to adapt between identical and differentiated configurations without manual redesign.
Solution Approach 2:
The parent circuit module acts as an intermediary between the replicated child modules and the external interface requirements. It provides a standardized interface layer that manages connections to auxiliary circuit components, ensuring that unconnected interfaces are properly handled while maintaining design replication across child modules.
3Ease of operation
If logic components are used at the parent level for configuration, then signal values can be controlled, but device complexity and resource outlay increase
Solution Approach 1:
Logic configuration functions are extracted from the parent circuit module and relocated to the child circuit modules themselves. The parent module only contains simple interconnect structures without logic components, while the configuration capability is embedded within each child module, reducing parent level complexity while maintaining operational control.
Solution Approach 2:
Each child circuit module is self-sufficient with its own logic components and configuration capabilities. The modules can independently manage their own signal values and auxiliary circuit connections without requiring complex parent-level logic control, allowing the parent module to remain simple while maintaining full configuration capability.
Data Source
AI summary
An integrated circuit comprises a plurality of child circuit modules in which each child circuit module has a base configuration that is common to each of the plurality of child circuit modules. The base configuration includes: a semiconductor logic component, one or more auxiliary circuit components, and one or more signal driver components. The integrated circuit further comprises a parent circuit module overlaying the plurality of child circuit modules. The parent circuit module includes a plurality of electrical interconnects. For each child circuit module, an electrical interconnect provides an electrical connection to the semiconductor logic component. For a first subset of the child circuit modules, an electrical interconnect provides an electrical connection to the auxiliary circuit component, and for a second subset of the child circuit modules, an electric interconnect provides an electrical connection between a signal driver component and the auxiliary circuit component of that child circuit module.