Repositionable RFID Inlay With Two-Stage Adhesive System
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Solution Overview
Problem
Current methods for applying RFID inlays to objects are limited by the inability to adjust or reposition them without damaging the inlay or the object, leading to potential misalignment and inefficiencies in inventory management and supply chain optimization.
Innovation Solution
The use of an RFID inlay with a temporary adhesive for initial placement and a activatable adhesive for permanent bonding, allowing for repositioning and precise alignment before securing the inlay to an object, utilizing a substrate and antenna configuration with patterned adhesives for flexibility and control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a permanent adhesive is used to attach the RFID inlay to the object, then the inlay is securely fixed, but the inlay cannot be repositioned or adjusted if placement is incorrect
Solution Approach 1:
The patent applies a two-stage adhesive system where the first adhesive provides temporary, repositionable bonding during placement adjustment, and the second adhesive provides permanent fixation after proper positioning is achieved. This dynamic transition from reversible to irreversible bonding resolves the contradiction between secure fixation and repositionability.
Solution Approach 2:
The adhesive system is segmented into two distinct functional layers: a first adhesive layer for temporary attachment and repositioning, and a second adhesive layer for permanent bonding. This segmentation allows each layer to perform its specific function optimally without interfering with the other.
2Productivity
If the RFID inlay is attached quickly using traditional methods, then productivity is improved, but manufacturing precision and alignment accuracy deteriorate
Solution Approach 1:
The first adhesive is applied in advance to allow the inlay to be temporarily positioned and aligned with the object before final attachment. This preliminary positioning action enables precise alignment to be achieved before the second permanent adhesive is activated, resolving the contradiction between speed and precision.
3Manufacturing precision
If misaligned RFID inlays are corrected by destroying and replacing them, then manufacturing precision is maintained, but loss of substance and productivity increase
Solution Approach 1:
The first adhesive is designed as a temporary, consumable element that enables correction without damage. Instead of destroying the inlay or object when misalignment occurs, the temporary adhesive allows repositioning, eliminating waste and reducing loss of substance while maintaining placement accuracy.
4Device complexity
If RFID inlays are permanently affixed immediately, then device complexity is reduced, but adaptability and ability to correct placement errors are lost
Solution Approach 1:
The adhesive system performs multiple functions: the first adhesive provides temporary bonding and repositioning capability, while the second adhesive provides permanent fixation. This multi-functionality allows the system to adapt to different stages of the attachment process, from initial placement to final securing, without requiring separate systems for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate placement of RFID inlays, reducing waste and overstocking by allowing for temporary adjustment and precise attachment, enhancing inventory management and supply chain responsiveness.
Implementation Method 1
a first pressure-sensitive adhesive at least partially disposed on the RFID inlay
Implementation Method 2
a second activatable adhesive at least partially disposed on the RFID inlay
Implementation Method 3
an antenna that transmits and receives radio waves
Data Source
Figure 1~2B
Figure 3A~3C
Figure 4~5
AI summary
An adjustable and repositionable RFID inlay is described herein. The RFID inlay comprises: a) a substrate having a first side and a second side; b) an antenna at least partially disposed on the first side of the substrate, and c) an RFID chip at least partially disposed on the first side of the substrate; wherein a first adhesive is at least partially disposed on the RFID inlay; and wherein a second adhesive is at least partially disposed on the RFID inlay. The second adhesive is an activatable adhesive. Also described herein is a method of positioning an RFID inlay with a first adhesive and a second adhesive where the second adhesive is an activatable adhesive. The method may further comprise repositioning the RFID inlay prior to activating the second adhesive to at least partially affix the RFID inlay to the object.