Non-Destructive Residual Conductor Length Measurement
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Solution Overview
Problem
Existing methods for measuring the length of residual conductive portions in back drilled holes of multilayer circuit boards require destructive cutting, rendering the boards unusable for further signal transmission.
Innovation Solution
A non-destructive measurement system comprising a measurement machine and a computer that calculates the length of residual conductive portions using the thickness and drilling depth of a reference circuit board, allowing for the determination of the residual conductive portion length in a to-be-tested circuit board without damaging it, utilizing an X-ray inspection machine or probe for measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive cutting method is used to measure residual conductive portion length, then measurement precision is improved, but the circuit board becomes unusable after measurement
Solution Approach 1:
The patent creates a virtual copy of the circuit board structure through 3D modeling and simulation. Instead of physically cutting the actual circuit board for measurement, the system generates a digital replica that can be measured repeatedly without damaging the original. This allows precise measurement of residual conductive portion length while preserving the circuit board for continued use.
Solution Approach 2:
The patent replaces the mechanical cutting method with a computational measurement system. Instead of using physical tools to cut and measure the circuit board, the system uses 3D imaging, virtual modeling, and computer-based calculation to determine residual conductive portion length. This substitution eliminates the destructive mechanical process while maintaining measurement accuracy.
2Measurement precision
If destructive cutting method is used for measurement, then measurement accuracy is improved, but production cost increases due to board destruction
Solution Approach 1:
The system creates a digital twin or virtual model of the circuit board structure, allowing repeated measurements without consuming physical material. The 3D model captures all necessary geometric information about residual conductive portions, enabling accurate measurement while eliminating material loss that would occur through physical cutting and disposal of measured boards.
Solution Approach 2:
The patent transforms the measurement approach from physical dimension changes (cutting boards to different sizes) to parameter-based measurement through 3D imaging and computational analysis. By changing from mechanical removal of material to digital parameter extraction, the system achieves accurate measurements without any material loss or substance destruction.
3Reliability
If non-destructive measurement method is used, then circuit board usability is preserved, but measurement precision may be compromised
Solution Approach 1:
The patent replaces mechanical measurement methods with optical or electromagnetic imaging techniques combined with computational analysis. Using 3D imaging capabilities and virtual modeling algorithms, the system achieves precise measurement of residual conductive portions without mechanical contact or destruction, thereby maintaining both board usability and measurement accuracy.
Solution Approach 2:
By creating accurate 3D digital copies or virtual models of the circuit board structure, the system enables precise measurement through computational methods rather than physical manipulation. The digital model preserves all geometric details of residual conductive portions, allowing high-precision measurement while keeping the original board intact and usable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the accurate measurement of residual conductive portion lengths without damaging the circuit board, allowing for continued use and reducing production costs by facilitating non-destructive monitoring.
Implementation Method 1
the measurement machine includes an X-ray inspection machine
Data Source
AI summary
A measurement system is provided, including a measurement machine and a computer. The measurement machine is configured to measure a thickness T1 of a to-be-tested circuit board and a drilling depth D1 of the to-be-tested circuit board. The computer calculates a length S1 of a residual conductive portion in a back drilled hole of the to-be-tested circuit board according to a thickness T of a reference circuit board, a drilling depth D of the reference circuit board, a length S of a residual conductive portion in a back drilled hole of the reference circuit board, the thickness T1 of the to-be-tested circuit board and the drilling depth D1 of the to-be-tested circuit board.


