Resilient Base Sensor Module for Panel Light Intensity
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Solution Overview
Problem
The existing sensing devices for light intensity in panel modules require additional tapes for attachment, leading to increased costs and potential detachment over time due to weakening adhesive strength.
Innovation Solution
A sensing device with a base that includes a resilient structure, featuring a resilient arm and abutting wing portion, which presses the base onto the back plate, sealing a containing slot and eliminating the need for tapes by securely attaching the sensor module between the back plate and holding frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional tapes are used to attach the sensing device to the back plate, then the sensing device can be securely fixed initially, but the manufacturing cost increases and the adhesive strength weakens over time causing detachment
Solution Approach 1:
The invention extracts and eliminates the tape component from the attachment system. The sensing device is designed with a resilient structure that directly engages with the back plate and holding frame, removing the need for adhesive tapes entirely. This resolves the contradiction by achieving secure attachment without the cost and reliability issues of tapes.
Solution Approach 2:
The resilient structure of the sensing device performs the attachment function autonomously through its elastic deformation. When assembled, the resilient structure automatically presses against the back plate and holding frame, creating a self-sustaining mechanical connection that does not require external adhesives or additional fastening components.
2Reliability
If additional tapes are used to attach the sensing device to the back plate, then the sensing device can be fixed in place, but the adhesive strength weakens with time causing detachment
Solution Approach 1:
The invention removes the adhesive tape component entirely, replacing it with a mechanical resilient structure. This eliminates the fundamental limitation of adhesive degradation over time, providing long-term attachment stability without relying on materials that weaken with age and usage.
Solution Approach 2:
The invention replaces the chemical adhesive bonding mechanism with a mechanical resilient structure. The elastic deformation and continuous contact pressure provided by the resilient structure create a more durable attachment that does not suffer from the time-dependent degradation characteristics of adhesive materials.
3Ease of operation
If tapes are used to attach the sensing device, then the device can be mounted on the back plate, but the solution increases manufacturing complexity and cost
Solution Approach 1:
The invention merges the attachment function into the sensing device structure itself through the resilient structure. Instead of being a separate component (tape), the attachment mechanism is integrated into the base of the sensing device, reducing the total number of components and simplifying the assembly process.
Solution Approach 2:
The resilient structure serves multiple functions simultaneously: it provides mechanical support for the sensing element, creates the attachment connection to the back plate, and maintains contact pressure for reliable operation. This multi-functionality reduces the need for separate components and simplifies the overall device design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and prevents detachment of the sensing device, ensuring reliable long-term operation by securely sealing the sensor module in place without the need for tapes.
Implementation Method 1
the resilient structure includes a resilient arm portion and an abutting wing portion. The resilient arm portion protrudes from the main body. The abutting wing portion is connected to the resilient arm portion and for abutting against the holding frame, wherein the resilient arm portion presses the main body onto the back plate
Data Source
AI summary
A sensing device for sensing a backlight density of a panel module is disclosed. The panel module includes a panel, a back plate and a holding frame. The back plate has an opening formed thereon and is for installing the panel onto the holding frame. The sensing device includes a sensor module and a base. The sensor module is for sensing a light projected via the opening and generated by the panel. The base is disposed between the back plate and the holding frame. The base includes a main body and a resilient structure. The main body is for containing the sensor module. The resilient structure extends from the main body and resiliently abuts against the holding frame. The resilient structure presses the main body onto the back plate when resilient abutting against the holding frame, such that the back plate and the main body cooperatively covers the sensor module.