Resilient Clamping Mechanism for Substrate Stabilization
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Solution Overview
Problem
Current clamping mechanisms for substrates during ultrasonic flip-chip mounting processes are inadequate, as they struggle to securely hold substrates due to their weightless and tiny size, leading to dislodgment during processing, especially when a top carrier is present, which prevents the bottom plate from contacting the substrate.
Innovation Solution
A clamping apparatus with a substrate carrier featuring a top and bottom plate and a clamping plate with resilient arms that extend through an opening to press the substrate against the bottom plate, securing it within the carrier and stabilizing it during ultrasonic mounting processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a top carrier is placed over the substrate to improve handling and robustness, then substrate stability is improved, but the bottom plate cannot contact the substrate for clamping
Solution Approach 1:
The clamping mechanism is segmented into multiple independent clamping members that can operate through openings in the top carrier plate, allowing each clamping member to independently contact and clamp the substrate without requiring the bottom plate to directly contact the substrate
Solution Approach 2:
The top carrier plate acts as an intermediary structure with openings that allow clamping members to pass through and contact the substrate. This intermediary structure enables both the protective covering function and the clamping function to coexist
2Reliability
If conventional plate clamping is used to secure the substrate, then substrate holding is achieved, but the method cannot be used when a top carrier is present
Solution Approach 1:
The clamping mechanism is designed to be universal by allowing clamping members to access the substrate through openings in the top carrier plate, making it adaptable to configurations with top carriers while maintaining reliable substrate holding capability
Solution Approach 2:
The clamping action is transferred from a direct bottom-plate-to-substrate contact in the vertical dimension to a through-plate clamping mechanism that operates through openings, adding a dimensional pathway through the top carrier
3Ease of operation
If the substrate is left unclamped to allow access, then processing operations can proceed, but the substrate easily gets dislodged with vibration or air
Solution Approach 1:
The top carrier plate has localized openings at specific positions that allow clamping members to contact the substrate only at necessary clamping points, providing localized stability while maintaining overall processing accessibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for secure holding and stabilization of substrates during processing, preventing dislodgment and enabling efficient handling and bonding without the need for frequent substrate transfer, while allowing for processing on both sides without obstructing the bottom plate's contact.
Implementation Method 1
a pair of resilient arms extending toward a center of the opening and through the cavity to press the substrate against the bottom plate
Implementation Method 2
The horn then aligns the device with the substrate and applies an ultrasonic energy that vibrates the device and causes it to bond to the substrate
Data Source
AI summary
A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.