Resilient Conductive Interconnect with Free-Flowing Particles

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Solution Overview

Problem

Traditional electrical interconnects face limitations in next-generation systems due to increased terminal count, reduced terminal pitch, and signal integrity issues, which affect mechanical compliance and electrical performance, leading to parasitic effects and impedance mismatch.

Innovation Solution

An interconnect assembly featuring a resilient material with through holes containing discrete, free-flowing conductive particles, providing mechanical compliance while minimizing non-conductive materials, and using additive printing processes to create refined electrical paths and features, reducing parasitic effects and enhancing signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If terminal pitch is reduced to increase terminal count, then more terminals can be accommodated, but the surface area available for contacts is reduced and compliance becomes more difficult

Engineering Contradiction:

Improveterminal countVSAvoidsurface area for contacts

Core Design Contradiction:

Quantity of substanceVSArea of stationary object

Solution Approach 1:

The contact member is segmented into multiple independent resilient contacts arranged in a grid pattern, allowing each contact to be optimized for compliance while maintaining high terminal count in reduced pitch applications

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contact members are designed with varying thicknesses and resilient properties to optimize compliance for different pitch requirements, enabling adaptation to reduced pitch while maintaining adequate contact surface area

Inventive Principle:

Principle #35Parameter changes

2Strength

If longer contact members are used to improve spring properties, then mechanical compliance is enhanced, but electrical performance deteriorates due to parasitic effects

Engineering Contradiction:

Improvespring propertiesVSAvoidelectrical performance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The contact members are designed with optimized length and thickness parameters to achieve the desired spring constant while minimizing parasitic inductance and resistance, balancing mechanical compliance with electrical performance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The contact members utilize copper alloy materials that provide both the necessary mechanical resilience and electrical conductivity, optimizing the balance between spring properties and electrical performance

Inventive Principle:

Principle #40Composite materials

3Reliability

If copper alloy contact members are used for conductivity, then electrical performance is improved, but corrosion resistance deteriorates due to oxidation

Engineering Contradiction:

Improveelectrical performanceVSAvoidoxidation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The contact members are constructed as composite structures with a copper alloy core for electrical conductivity and a nickel plating layer for corrosion resistance, combining the benefits of both materials

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

A nickel plating layer is applied as an intermediary protective coating on the copper alloy contact members, preventing direct exposure to oxidizing environments while maintaining electrical conductivity

Inventive Principle:

Principle #24Intermediary (Mediator)

4Strength

If traditional resilient contact members are used, then mechanical compliance is achieved, but electrical parasitic effects increase

Engineering Contradiction:

ImprovecomplianceVSAvoidparasitic effects

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The contact members are designed with optimized geometric parameters including reduced length and adjusted thickness to minimize parasitic inductance and resistance while maintaining adequate mechanical compliance for reliable electrical connection

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables fine contact-to-contact spacing, low contact resistance, and improved signal performance, allowing for reliable connections without the need for reflow soldering, suitable for high-frequency applications and reducing the complexity of IC packages and PCBs.

Implementation Method 1

a resilient material with a plurality of through holes... The resilient material provides the required resilience

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

A plurality of discrete, free-flowing conductive particles is located in the through holes... the conductive particles provide a conductive path substantially free of non-conductive materials

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9231328B2Resilient conductive electrical interconnect

Publication Date: 2016.01.05 LCP MEDICAL TECHNOLOGIES LLC

AI summary

An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.