Resilient Grasping Tool With Reduced Contact Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The handling and placement of small, sensitive electronic components during manual assembly or repair operations are challenging due to their fragility and size reduction, leading to component damage and excessive rework.
Innovation Solution
A grasping tool with resilient arms and lateral members that form a 'V' shape, featuring reduced contact surfaces and interstices to securely grasp and position components, reducing surface area contact and preventing residue adhesion during soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional grasping tools are used to handle small electronic components, then the components can be grasped and positioned, but the components are susceptible to damage due to excessive contact surface area and residue adhesion during soldering
Solution Approach 1:
The patent extracts only the necessary contact points needed to grasp the component, removing unnecessary contact surfaces. The grasping tool features discrete contact surfaces at the tips of laterally extending members that contact the component, while the bodies of these members are spaced away from the component, preventing residue adhesion on large surface areas.
Solution Approach 2:
The patent applies local quality by providing contact surfaces only at specific locations (tips of laterally extending members) rather than across the entire grasping tool. This localized contact approach ensures firm grasping at critical points while minimizing the overall contact area to prevent residue adhesion and component damage during soldering.
2Ease of operation
If conventional grasping tools with continuous contact surfaces are used, then components can be held securely, but movement and residue adhesion occur during soldering processes
Solution Approach 1:
The patent segments the contact surfaces into discrete, separated contact points at the tips of laterally extending members rather than using continuous contact surfaces. This segmentation allows the tool to hold the component securely at multiple points while preventing residue adhesion on large continuous surfaces and reducing component movement during soldering.
Solution Approach 2:
The patent removes unnecessary contact surfaces from the grasping tool structure, keeping only the essential contact points at the tips of laterally extending members. This extraction of excess contact area prevents residue adhesion while maintaining secure component holding through strategically positioned contact points.
3Strength
If grasping tools with large contact surfaces are used to ensure firm grasping, then components can be held securely, but component damage and excessive rework result from residue adhesion
Solution Approach 1:
The patent concentrates grasping force at local contact points (tips of laterally extending members) rather than distributing it across large surfaces. This localized force application ensures firm grasping strength where needed while minimizing the contact area to prevent residue adhesion and subsequent component damage or rework.
Solution Approach 2:
The patent removes unnecessary contact surfaces that would otherwise be present on conventional grasping tools. By extracting excess contact area and retaining only essential contact points, the tool maintains sufficient grasping strength while preventing residue adhesion that leads to component damage and rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool securely holds and positions electronic components, minimizing movement and residue adhesion, enabling consistent and clean release, thus reducing damage and rework during assembly and repair operations.
Implementation Method 1
a first arm (114) and a second arm (116) resiliently joined together at one end
Data Source
AI summary
A tool for grasping an electronic component that includes a first arm and a second arm resiliently joined together at one end and each separately extending to free end opposite from each other and spaced apart while at rest. The tool further includes a first and a second extension each attaching to the free end of the respective arms, and a lateral member extending from each extension towards the opposing extension. The extensions and lateral members each have at least one contact surface and the bottom surfaces of the lateral members and inner surfaces of the extensions recede from the contact surfaces, reducing the surface area of contact when an object is grasped with the tool.


