Resilient Heat Sink Mount for Expansion Card Access
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Solution Overview
Problem
The existing heat dissipaters for expansion cards are difficult to remove or replace due to limited space on the motherboard, making it challenging for users to access and replace them without disassembling screws and navigating around closely disposed electronic components.
Innovation Solution
A heat dissipater resilient structure with a bendable arm and fixing member that allows the expansion card heat dissipater to pop up automatically, enabling easy access and replacement by moving between two positions, with the arm extending upwardly and a perforated slot for secure attachment to the motherboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the heat dissipater is fixed to the expansion card or motherboard through screws, then the heat dissipater can be securely attached, but it becomes difficult to remove or replace due to limited space and closely disposed electronic components
Solution Approach 1:
The patent applies the dynamics principle by replacing static screw fastening with a dynamic resilient structure featuring a bendable arm. The arm can be flexed to release the heat dissipater from its clamped position, allowing easy removal without tools. The resilient nature provides both secure attachment during operation and convenient release when needed, resolving the contradiction between strong fixation and ease of removal.
Solution Approach 2:
The patent substitutes the traditional mechanical screw-fastening system with a resilient clamp mechanism. Instead of using threaded fasteners requiring manual manipulation in tight spaces, the invention uses elastic deformation of a bendable arm to achieve both secure attachment and tool-free removal, replacing complex mechanical assembly with simpler elastic mechanics.
2Reliability
If the heat dissipater is securely fastened with screws, then it remains stable during operation, but the structure becomes more complex and requires more components
Solution Approach 1:
The patent applies segmentation by dividing the fastening function into two independent components: a resilient structure with a bendable arm for attachment, and a separate locking member for securing. This segmentation allows each component to be optimized independently - the resilient arm provides stable contact pressure while the locking member ensures operational reliability, reducing overall structural complexity compared to screw-based systems.
Solution Approach 2:
The resilient structure serves multiple functions: it provides both the clamping force for secure attachment and the mechanism for easy release. The bendable arm inherently provides both stabilization during operation and accessibility for removal, eliminating the need for separate fastening and release mechanisms, thus reducing device complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates convenient removal and replacement of the expansion card heat dissipater by allowing it to move to a higher position, providing clearance for easy handling and maintenance without the need to disassemble screws, while maintaining secure attachment during operation.
Implementation Method 1
The arm extends from the body and is bendable between a first position and a second position
Data Source
AI summary
A heat dissipater resilient structure is adapted to be fixed to a connector of a motherboard and for an expansion card heat dissipater to be disposed on. The heat dissipater resilient structure includes a body, an arm and a fixing member. The body is adapted to be fixed to the connector. The arm extends from the body and is bendable between a first position and a second position. The fixing member is located at the body or the arm. The expansion card heat dissipater is adapted to be fixed to the fixing member and lean against the arm to move with the arm. When pressed, the expansion card heat dissipater is adapted to move with the arm from the first position to the second position. When not pressed, the arm moves with the expansion card heat dissipater to return to the first position. A connector module is further provided.